Products

Cleanroom® LP Acetic Acid is used in mixed acid etchants and in SEZ etchants. Acetic acid is used in place of water to help keep nitric acid from dissociating, which makes for a more oxidizing solutions.

Cleanroom® MB Hydrofluoric Acid 49% is a critical chemistry in semiconductor processing. It is used to solubilize many oxides, particularly silicon dioxide, the most widely used insulator on semiconductor devices.

KMG Chemicals 1,2-Ethylenediamine 40% is used in anistropic silicon etchants to preferentially etch one silicon lattice, namely <100> and <110> over <111> crystalline orientation.

KMG Chemicals Cyclohexanone is used as a solvent for photoresist, an edge bead remover, and a general solvent for organic polymers resists.

Cleanroom® MB Hydrochloric Acid 37% is a key ingredient to remove surface metallic ions by forming soluble metal chlorides. In semiconductor processing, the presence of metallic impurities on the wafer can lead to early dielectric breakdown.

Cleanroom® LP MEK is a strong solvent that is typically used as a negative photoresist remover.

Cleanroom® LP Acetone can be used for drying laboratory glassware, removing greasy or oily contaminants from work benches, or as a general photoresist stripper or edgebead remover.

Cleanroom® LP Ethylene Glycol 50% is a high purity process chemical for semiconductor rinse applications and in a high purity cooling system.

Cleanroom® MB Hexamethyldisilazane (HMDS) is an adhesion promoter between photoresist and the silicon wafer.