Products

NAMICS-Diemat H 9940 is a die attach adhesive (conductive, heat-curing type). It has high thermal conductivity and high reliability. It has applications in QFP and QFN.

NAMICS-Diemat H 9683 is a die attach adhesive (conductive, heat-curing type). It has high thermal conductivity, excellent adhesive strength and is void free. It has applications in QFP and QFN.

NAMICS-Diemat H 9863 is a die attach adhesive (conductive, heat-curing type). It is applicable for blue and white light with good heat resistance and light resistance.

NAMICS-Diemat H 9807 is a flip chip adhesive. It has low stress and high reliability and is used in SBB.

NAMICS-Diemat Chipcoat G8345-29 is a dam-and-fill encapsulant. It has low warpage and is a fine filler.

NAMICS-Diemat H 9626 is a surface mounting adhesive. These are precious metal electrodes, for bonding parts applications.

NAMICS-Diemat H 9800 is a die attach adhesive (conductive, heat-curing type). It has non-bleeding and good adhesion at high temperatures. It has applications in QFP and QFN.

NAMICS-Diemat H 9626D is a surface mounting adhesive. These are precious metal electrodes, for bonding parts applications.

NAMICS-Diemat H 9672 is a surface mounting adhesive. These have high purity used for bonding parts applications.

NAMICS-Diemat Chipcoat G8345D is a dam-and-fill encapsulant. It has a sharp dam shape.

NAMICS-Diemat H 9607 is a die attach adhesive (conductive, heat-curing type). It is applicable for all LED colors. It has good adhesion at high temperature.

NAMICS-Diemat Chipcoat G8345D-37 is a dam-and-fill encapsulant. It has a sharp dam shape and it is a fine filler.

NAMICS-Diemat Chipcoat G8345-6 is a dam-and-fill encapsulant. It has low warpage and high fluidity.