Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Key Features
These conductive adhesives are heat-cured to accommodate various applications, including die bonding, LED bonding, lead bonding, and high thermal conductivity.
Applications & Uses
- Applications
- Application Area
- Cure Method
- Application Method
Dispensing
Properties
- Typical Properties
- Cured Properties
Value | Units | Test Method / Conditions | |
Viscosity (HBT, 10rpm) | 30.0 | Pa・s | - |
Volume Resistivity | 4.5 x 10⁻⁵ | Ω・cm | - |
Adhesive Strength | 13.0 | N/mm² | - |
Thermal Conductivity | 12.0 | W/mK | - |
Value | Units | Test Method / Conditions | |
Curing Conditions (25 - 200 °C) | 30.0 | minutes | - |
Curing Conditions (200°C) | 15.0 | minutes | - |