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NAMICS-Diemat H 9940

NAMICS-Diemat H 9940 is a die attach adhesive (conductive, heat-curing type). It has high thermal conductivity and high reliability. It has applications in QFP and QFN.

Product Type: Conductive Adhesive

Application Area: Circuit Substrates

Cure Method: Heat Cure

    Knowde Enhanced TDS

    Identification & Functionality

    Features & Benefits

    Ready-to-Use Product Features
    Key Features

    These conductive adhesives are heat-cured to accommodate various applications, including die bonding, LED bonding, lead bonding, and high thermal conductivity.

    Applications & Uses

    Application Area
    Cure Method
    Application Method

    Dispensing

    Properties

    Typical Properties
    ValueUnitsTest Method / Conditions
    Viscosity (HBT, 10rpm)30.0Pa・s-
    Volume Resistivity4.5 x 10⁻⁵Ω・cm-
    Adhesive Strength13.0N/mm²-
    Thermal Conductivity12.0W/mK-
    Cured Properties
    ValueUnitsTest Method / Conditions
    Curing Conditions (25 - 200 °C)30.0minutes-
    Curing Conditions (200°C)15.0minutes-