Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Key Features
These are heat-cured conductive adhesives that are resistant to high-temperature solder reflow, and can be processed at low temperatures to accommodate lead-free mounting.
Applications & Uses
- Applications
- Application Area
- Application Method
- Cure Method
- Application Method
Dispensing (Jet Dispensable)
Properties
- Typical Properties
- Cured Properties
Value | Units | Test Method / Conditions | |
Viscosity (10rpm) | 47.0 | Pa・s | — |
Volume Resistivity | 2 x 10⁻⁴ | Ω・cm | — |
Adhesive Strength | 40.0 | N/mm² | — |
Value | Units | Test Method / Conditions | |
Curing Conditions (150°C) | 30.0 | minutes | — |