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NAMICS-Diemat H 9800

NAMICS-Diemat H 9800 is a die attach adhesive (conductive, heat-curing type). It has non-bleeding and good adhesion at high temperatures. It has applications in QFP and QFN.

Product Type: Conductive Adhesive

Application Area: Circuit Substrates

Cure Method: Heat Cure

    Knowde Enhanced TDS

    Identification & Functionality

    Features & Benefits

    Key Features

    These conductive adhesives are heat-cured to accommodate various applications, including die bonding, LED bonding, lead bonding, and high thermal conductivity.

    Applications & Uses

    Application Area
    Cure Method
    Application Method

    Dispensing

    Properties

    Typical Properties
    ValueUnitsTest Method / Conditions
    Viscosity (E Type, 5rpm)16.0Pa・s-
    Volume Resistivity7.0 x 10⁻³Ω・cm-
    Adhesive Strength45.0N/mm²-
    Thermal Conductivity2.0W/mK-
    Cured Properties
    ValueUnitsTest Method / Conditions
    Curing Conditions (150°C)30.0minutes-