- Polymer Name:Polycarbonate (PC)
- Processing Methods:Injection Molding
- Flexural Modulus:6000.0 - 6000.0 MPa
Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H ES DP110/X3 is a natural, thermally conductive polycarbonate, combining good thermal conductivity with improved HDT and processability relative to conventional polycarbonate compounds.Applications: Housings for power components. Encapsulation/housings for bobbins, actuators, and coils. IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. LED lighting assemblies.