Products

ECP 1015 is a proprietary injection molding compound utilizing special fillers to give a permanently conductive anti-static material and reinforced material. The compound is designed to comply with the electrical conductivity requirements for materials laid out in Defense Standard (59-98) and BS EN 61340-5-1:2007. Moldings made from ECP 1015 exhibit excellent dimensional stability. The material flows well and the formulation allows for homogeneous conductivity in a variety of cross-sections of molding. The material is tough, strong with good impact performance and is black in color.

ECP 2747 is a proprietary TBA injection molding compound utilizing a special non-migratory additive system to give a permanently static dissipative material. The material is specially designed for applications requiring static control such as electronic safe handling areas and hazardous environments where anti static and ESD (electro static discharge) is required.

ECP 9603 Conductive PC/PBT Carbon Nanotube Injection Molding Compound. ECP 9603 is a proprietary injection molding compound utilizing multi-wall carbon nanotube technology to give a permanently anti-static, conductive material. Special compounding techniques at low filler loadings ensure the retention of physical properties and excellent cleanliness.

ECP 104 Anti Static Conductive Polypropylene is a proprietary injection molding compound utilizing special Carbon Black and mineral filler to give a permanently conductive material. The compound is designed to comply with the electrical conductivity requirements for materials laid out in Defense Standard (59-98) and BS EN 61340-5-1: 2007

ECP 110 Anti Static High Impact Conductive Polypropylene is a conductive Polypropylene based on Conductive Carbon Black and Polypropylene co-polymer suitable for injection molding and profile extrusion. It is designed to comply with the electrical conductivity requirements laid out in Defense Standard 59 - 98 (1979) and BS IEC 61340-5-1-2007 for the protection of electronic components from electrostatic damage.

Permanently anti-static dissipative colourable PP. Suitable for injection molding and extrusion. Compliant with ATEX requirements and BS IEC 61340-5-1:2007. It is an injection molding compound utilizing a special non-migratory additive system to give a permanently anti-static dissipative material. The material is specially designed for applications requiring static control such as electronic safe handling areas and hazardous environments.

ECP 41899 is a proprietary injection molding compound utilizing special polymer alloys to give a permanently anti static dissipative material. The material is specially designed for applications requiring static control and good optical qualities eg, transparency.

ECP 145/4332 Anti Static Conductive Nylon 6 Injection Molding Compound for injection molding and extrusion applications, Injection molding compound based on Nylon 6 and special conducting Carbon Blacks. The compound has been specially formulated with impact modification to provide a compromise of strength with the electrical conductivity requirements laid out for materials in BS IEC 61340-5-1:2007 and DEF Std 59-98.

ECP 41158 is a proprietary injection molding compound utilizing special polymer alloys to give a permanently anti static dissipative material. The material is specially designed for applications requiring static control and good optical qualities eg, transparency. The material is ideal for use in hazardous environments where static dissipation properties are required.

ECP 2368 is a proprietary TBA injection molding compound utilizing a special non-migratory additive system to give a permanently static dissipative material. The material is specially designed for applications requiring static control such as electronic safe handling areas and hazardous environments. Used for anti static applications where ESD (electro static discharge) is to be avoided.

ECP 128 is low dust, anti-static, conductive rotational molding compound based on carbon black and low-density polyethylene. It is designed to comply with the electrical conductivity requirements for materials as described in Defense Standard 59-98 (1979) and BS IEC 61340-5.1:2007. specifications that refer to the protection of electronic components from electrostatic damage.