Products in Printing & Packaging: Epoxy Adhesive

Epilox AF 18-30 is a liquid and solventless blend of standard bisphenol A and bisphenol F epoxy resins with good resistance to crystallization.

Kanamoll is a vegetable oil-based light colored secondary plasticizer. ESBO is manufactured from soybean oil through the process of epoxidation. It is been used widely as plasticizer because of high numbers of epoxidized carbon-carbon double bonds. The epoxide group is more reactive due to double bonds, thus making it a good hydrochloric acid scavenger and plasticizer.

XYSIL® R120H is a fumed silica after treated with PDMS(Polydimethylsiloxane). It is based on a hydrophilic fumed silica with a specific surface area of 150m2/g.

EkaSol™ 1 is a VOC compliant, low toxicity solvent that is an efficient and cost effective replacement for Methyl Ethyl Ketone (MEK).

Epilox A 18-00 is a low viscosity and solventless bisphenol A epoxy resin which may crystallize on storage.

Epilox T 19-27 is a liquid and solventless blend of standard bisphenol A and bisphenol F epoxy resins with good resistance to crystallization.

Epilox A 19-02 is medium viscosity and solventless bisphenol A epoxy resin.

ZemaSol™ is a VOC-compliant, safe, low toxicity solvent that is an efficient, cost effective alternative to Xylene, Toluene, Parachlorobenzotrifluoride (PCBTF/Oxsol 100®) and Tertiary Butyl Acetate (TBAc).

Epilox AF 18-50 is a liquid and solventless blend of standard bisphenol A and bisphenol F epoxy resins with good resistance to crystallization.

Epilox T 19-36/1000 is a modified, low viscosity epoxy resin with reduced crystallization tendency. Crosslinking with suitable curing agents is preferably performed at room temperature.

Epilox T 19-36/700 is a modified, low viscosity epoxy resin with reduced crystallization tendency. Crosslinking with suitable curing agents is preferably performed at room temperature

Epilox T 19-32/1000 is a modified, low viscosity epoxy resin with reduced crystallization tendency. Crosslinking with suitable curing agents is preferably performed at room temperature.

Epilox T 19-34/700 is a modified, low viscosity epoxy resin which is resistant to crystallization. Crosslinking with suitable curing agents is preferably performed at room temperature.

XYSIL® R120B is a fumed silica after treated with DDS(Dimethyldichlorosilane). It is based on a hydrophilic fumed silica with a specific surface area of 150m2/g.

Epilox A 85-02 is an unmodified epoxy resin based on bisphenol A and epichlorohydrin.

Epilox T 19-35/500 is a modified, low viscosity epoxy resin which is resistant to crystallization. Crosslinking with suitable curing agents is preferably performed at room temperature.

Shandong Huijin Chemical 300 polyamide curing agent is vegetable oil and ethylene amine dimer acid synthesis.

Kanamoll 650 is a vegetable oil-based light colored secondary plasticizer. ESBO is manufactured from soybean oil through the process of epoxidation. It is been used widely as plasticizer because of high numbers of epoxidized carbon-carbon double bonds. The epoxide group is more reactive due to double bonds, thus making it a good hydrochloric acid scavenger and plasticizer.

Shandong Huijin Chemical 651(400) polyamide curing agent is vegetable oil and ethylene amine dimer acid synthesis.

Epilox A 19-00 is a medium viscosity and solventless bisphenol A epoxy resin which may crystallize on storage.

Epilox T 19-32/1000 is a modified, low viscosity epoxy resin with reduced crystallization tendency. Crosslinking with suitable curing agents is preferably performed at room temperature.

NOFO 1032 is a blend of silicone and organic acid esters. Designed for use in most nonaqueous based coating systems, adhesives and inks. Allows for air release of high build epoxy, urethane, and various casting resins.

Epilox F 17-00 is a liquid epoxy resin on the basis of bisphenol F and epichlorohydrin.