Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- CASE Ingredients Functions
- Technologies
- Product Families
Features & Benefits
- Labeling Claims
- CASE Ingredients Features
- General Performance
- Good flexibility and toughness
- Long working pot life
- Good water and Corrosion resistance
- Wide range of compatibility with epoxy resins
- Low shrinkage on cure and exceptional dimensional stability
- Excellent resistance to mechanical impact or shock
- High flexural, compressive and tensile strength
- Excellent adhesion and bonding to a wide variety of substrates
- Possibility for a variety of end uses
- Product Highlights
Reactive Polyamides have been the workhorse of Epoxy Coating Industry for many years. Polyamide resins are high molecular-weight polymers which feature amide linkages along with the molecular chain.
Polyamide resin, which has been widely used as a curing agent for epoxy resin, is formed by the condensation reaction between dimerised fatty acid with polyamines. Molecular weights are controlled by using monobasic fatty acid as a chain terminator. Polyamides contain reactive primary and secondary amines in its molecules
Polyamides are versatile curing agents for epoxies. They are compatible with many epoxy resins, and their mixing ratio with the resins is not critical. Fairly long pot life is possible using polyamides and one can get casting with good impact strength as well as excellent adhesion to different substrates. Some polyamides are used as flexibilizers as well as a curing agent.
Polyamide Adducts provide good compatibility and better cure under adverse conditions
Applications & Uses
- Markets
- Applications
- Coating Type
- Typical Applications
- olvent-borne and two pack epoxy coatings
- Epoxy Primers and Top coats
- Coal tar epoxy coatings
- Adhesives
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Solids Content | Solvent free | % NVM | — |
| Color | 10 | Gardner | — |
| Viscosity at 40°C | 2000-5000 | — | — |
| Amine Value | 210-230 | mg KOH/g | — |
| AHEW | 150 | — | — |
| PHR with Epoxy Resin (EEw-190) | 70-100 | — | — |
| Thin Film Set Time at 25°C (200 µ WFT) | 8 | — | — |