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ADMAFINE SO-E1 is used in electronic devices, filler for epoxy molding compound, fillers for printed circuit boards. It is usesd as resin filling materials engineering plastics, filler for paint, filler for precise plastic molding. It is used in ceramics molding products and in anti-blocking materials.

Functions: Filler, Slip Control Agent

Chemical Family: Carbonates, Silica

Compatible Polymers & Resins: Acrylics, Epoxies (EP)

Particle Size: 0.2 - 0.4 microns

Features: Absorbs IR, Chemical Resistance, Excellent Dispersibility, High Gloss, Improves Adhesion, Narrow Particle Size Distribution

    Knowde Enhanced TDS

    Identification & Functionality

    Chemical Family
    CASE Ingredients Functions
    Technologies

    Features & Benefits

    Product Highlights
    • Spherical particles characterized by sharp particle size distribution.
    • Average particle size can be controlled from 0.2 to 2.0 µm as desired.
    • High purity, fewer ionic impurities, non-porous surface, and excellent dispersibility.
    • The SO-E type is the grade compatible with chips (e.g. memory chips).
    • High-purity products use the low-alpha beam grade, specialized for chips, such as memory. As regular products do not contain ionic impurities, they can be used for electronic devices.

    Applications & Uses

    Compatible Polymers & Resins

    Properties

    Physical Form
    Typical Properties
    ValueUnitsTest Method / Conditions
    Cl- Contentmax. 1.0ppm
    EC Contentmax. 6μS/cm
    K+ Contentmax. 0.5ppm
    Median Particle Diameter0.2 - 0.4μm
    Na+ Contentmax. 0.5ppm
    pH Value4.5 - 6.0
    Specific Surface Area10 - 20m2/g
    Composition
    ValueUnitsTest Method / Conditions
    Al Contentmax. 100ppm
    Fe Contentmax. 20ppm
    Moisture Contentmax. 0.05%
    SiO2 Contentmin. 99.9%
    U Contentmax. 0.3ppb

    Technical Details & Test Data

    Particle Size Distribution / SEM Image

    ADMAFINE SO-E1 - Particle Size Distribution / Sem Image