- Applications:Semiconductor Manufacturing, Adhesives & Sealants, Appliances & Electronics
- Product Families:Conductive Adhesives, Adhesives & Sealants
ME8650-RC is designed for needle dispensing and screen-printing processing. This silver filled conductive die-attach adhesive can be rapidly cured at low temperatures. This single component, silver filled paste is ambient storable electrically and thermally conductive. It is highly thixotropic with minimal sag. ME8650-RC has been designed to minimize bleeding on both silver plated copper and alloy 42 lead frames. Maintains more than 100 psi bond strength at 250°C for wire-bonding.