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AI Technology ME 8650-RC

ME8650-RC is designed for needle dispensing and screen-printing processing. This silver filled conductive die-attach adhesive can be rapidly cured at low temperatures. This single component, silver filled paste is ambient storable electrically and thermally conductive. It is highly thixotropic with minimal sag. ME8650-RC has been designed to minimize bleeding on both silver plated copper and alloy 42 lead frames. Maintains more than 100 psi bond strength at 250°C for wire-bonding.

Product Type: 1K (1 component) Adhesive, Epoxy Adhesive

Application Area: Die/Chip Attach

Cure Method: Heat Cure

Application Method: Injection

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Product Features
  • Flexible.
  • Moisture resistant.
  • High green strength.
  • 100% solid.
  • Epoxy paste adhesive.
  • Low bleeding.
  • Large area die attach.
  • High temperature wirebondable.
  • Component attach.
  • Substate attach.

Applications & Uses

Application Area
Application Method
Cure Method
Application Procedures
  • Thaw for 30 mins before opening jar or using syringes.
  • Dispense adhesive onto clean substrate with a suitable pattern to assure full die coverage.
  • Cure according to the recommended schedules.

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivity (at 150°C, 60minutes)max. 5x10⁻⁴Ω-cm
Glass Transition Temperature-20°C
Glass Transition Temperature-50 to -20°C
Current Carrying Capabilities50Amp/mm²
Device Push Off Strengthmin. 10.3N/mm²
Hardness72 - 88Shore D
Cured Density3.15 - 3.85g/cc
Thermal Conductivitymin. 6.0W/m-°C
Thermal Conductivitymin. 7.9W/m-°C
Thermal Conductivity7.11 - 8.69W/m-°C
Coefficeint of Linear Thermal Expansion85 - 115ppm/°C
Maximum Continuous Operation Temperaturemax. 150°C
Viscosity (at 24°C, 5rpm, Spindle CP51, Thixotropic Index=3-5)14400 - 21600cPsBrookfield Viscometer DV-1
Electrical Resistivitymax. 4x10⁻⁴Ω-cm
Electrical Resistivitymax. 5x10⁻⁴Ω-cm
Die Shear Strengthmin. 1500psi
Viscosity (at 0.5 rpm, Thixotropic Index=>4)15000cPs
Viscosity (at 5 rpm, Thixotropic Index=>4)18000cPs

Regulatory & Compliance

Certifications & Compliance

Technical Details & Test Data

Cure Schedules
Temperature Time
80°C 120 mins
100°C 60 mins
125°C 30 mins
150°C 15 mins
175°C 8 mins

Packaging & Availability

Product Availability

ME8650-RC is available in syringes or in jars.

Storage & Handling

Shelf Life
1 Year (at -40°C), 30 Days (at 25°C)
Storage Information

Storage temperature: -40°C.

Pot life: 25°C for >5 days.