Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Labeling Claims
- Ready-to-Use Product Features
- Non- Silicone Advantages
Silicone-based compounds have an undesirable tendency to physically migrate and contaminate components nearby. This interferes with circuit operation long after hardware installation to cause unexpected, untimely and often inaccessible problems. The AOS Heat Sink Compound’s no creep feature extends circuit life by protecting components longer and by eliminating premature failure of adjacent components caused by migrating silicone base fluid.
Applications & Uses
- Markets
- Application Area
- Major Applications
- Thermal applications for compound include the dissipation of heat from high power electronic components such as power resistors, rectifiers, transistors and transformers.
- Low power electronic applications include static drain, grounding, soft electronic connections, heat dissipation, and assembly protection. Compound can be used in high power electrical applications to improve the operational efficiency of high power switches and other sliding metal contacts.
Properties
- Color
- Physical Form
- Appearance
- Smooth, Black Paste
- Typical Properties
- Electrical Properties
| Value | Units | Test Method / Conditions | |
| Bleed (200°C, 24 Hrs, %/Wt) | 0.5 | % | FTM-321 MODIFIED |
| Evaporation (200°C, 24 Hrs, %/Wt.) | 1.0 | % | FTM-321 MODIFIED |
| Operating Temperature Range | -40 to 200 | °C | - |
| Thermal Conductivity (36°C) | 1.0 | W/m-K | ASTMD 5470-06 |
| Thermal Resistance (50°C) | 0.08 | °C/W | Oracle TTV Model 270-7806-01 |
| Viscosity (1 sec-1 , 25°C) | 910000.0 | cP | ARES G-2 RHEOMETER |
| Viscosity (1 sec-1 , 50°C) | 730000.0 | cP | ARES G-2 RHEOMETER |
| Value | Units | Test Method / Conditions | |
| Volume Resistivity | 304.0 | ohm-cm | ASTM D257 |
Regulatory & Compliance
- Certifications & Compliance
Storage & Handling
- Shelf Life
- 5 Years