Products

APPLI-TEC 5336 Epoxy is a black, electrically isolating, thermally conductive epoxy designed specifically for staking and encapsulating electronics on circuit boards as well as potting and encapsulating power supplies, transformers, and coils. This material is ideal for applications requiring a thermally conductive epoxy with resistance to solvents and chemicals. 5336 is supplied in frozen syringes.

APPLI-TEC 5308 Epoxy is an electrically isolating material, 5308 was designed specifically for underfilling, staking and encapsulating electronics on circuit boards, as well as potting and encapsulating power supplies, transformers, and coils. Featuring a 3-hour pot life, 5308 has good flowability, making it ideal for applications requiring a self-leveling material. The material meets NASA’s outgassing requirements, is resistant to solvents and chemicals, and is considered non-hazardous per D.O.T. regulations.

APPLI-TEC 5200 Epoxy is a silver-filled, electrically conductive, low outgassing epoxy, Appli-Tec’s 5200 is specifically designed to cure with low shrinkage at room temperature or cure quickly at elevated temperatures. The material is ideal for applications such as electrical bonding, EMI shielding, and room temperature soldering. 5200 exhibits a high thermal conductivity of 2.5 W/mK and a low volume resistivity of 0.002 ohm-cm, delivering excellent thermal and electrical conductivity across the bond line. Appli-Tec 5200 silver epoxy is available in bulk kits or two-part mixer pouches that can be stored at room temperature and mixed on site. We can also pre-mix, test, pre-pack and then flash freeze the material in manual or pneumatic dispense syringes, which are easily thawed at room temperature. The material is listed on NASA’s Low Outgassing website.