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33N is a flame retardant (UL94 V-O) polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with flame retardance. High Tg (250°C) results in low overall z-axis expansion, and minimizes risk of latent PTH defects in-service.

Polymer Name: Polyimide (PI)

Functions: Laminate, Prepreg

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Chemical Family
Polymer Name
Composite Materials Functions

Features & Benefits

Labeling Claims
Materials Features

Applications & Uses

Properties

Flame Rating
Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Water Absorption (0.062)0.21%IPC TM-650 2.6.2.1
Peel Strength to Copper (1 oz/35 micron) After Thermal Stress7.2 (1.2)lb/in (N/mm)IPC TM-650 2.4.8
Peel Strength to Copper (1 oz/35 micron) at Elevated Temperatures7.2 (1.2)lb/in (N/mm)IPC TM-650 2.4.8.2
Peel Strength to Copper (1 oz/35 micron) After Process Solutions7.5 (1.3)lb/in (N/mm)IPC TM-650 2.4.8
Young's Modulus3.2Mpsi (GPa)IPC TM-650 2.4.18.3
Poisson's Ratio0.15-ASTM D-3039
Specific Gravity1.6g/cm3ASTM D792 Method A
Thermal Conductivity0.2W/mkASTM E1461
FlammabilityV-0classUL-94
Thermal Properties
ValueUnitsTest Method / Conditions
Glass Transition Temperature (Tg) - TMAmin. 250°CIPC TM-650 2.4.24
Coefficient of Thermal Expansion (X,Y)16ppm/°CIPC TM-650 2.4.41
Coefficient of Thermal Expansion (Z) - Below Tg53ppm/°CIPC TM-650 2.4.24
Coefficient of Thermal Expansion (Z) - Above Tg164ppm/°CIPC TM-650 2.4.24
z-axis Expansion (50-260oC)1.2%IPC TM-650 2.4.24
Decomposition Temperature (Td) - Initial353°CIPC TM-650 2.4.24.6
Decomposition Temperature (Td, 5%)389°CIPC TM-650 2.4.24.6
T28823minIPC TM-650 2.4.24.1
T3008minIPC TM-650 2.4.24.1
T260min. 60minIPC TM-650 2.4.24.1
Electrical Properties
ValueUnitsTest Method / Conditions
Electrical Strength1290 (50.8)Volts/mil (kV/mm)IPC TM-650 2.5.6.2
Dielectric Constant (1 MHz)4.25Multilayer ~ 50% RCIPC TM-650 2.5.5.3
Dielectric Constant (1 GHz)4.1Multilayer ~ 50% RCIPC TM-650 2.5.5.9
Dissipation Factor (1 MHz)0.01-ASTM D 150
Volume Resistivity (C96/35/90)7.2 x 10^7MΩ-cmIPC TM-650 2.5.17.1
Volume Resistivity (E24/125)4.5 x 10^8MΩ-cmIPC TM-650 2.5.17.1
Surface Resistivity (C96/35/90)4.1 x 10^8IPC TM-650 2.5.17.1
Surface Resistivity (E24/125)1.6 x 10^9IPC TM-650 2.5.17.1
Dielectric Breakdownmin. 40kVIPC TM-650 2.5.6
Arc Resistance170secASTM D495

Regulatory & Compliance