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84N is a high performance ceramic-filled polyimide prepreg based on Arlon’s 85N pure polyimide system, designed for use in filling etched areas in polyimide multilayers that contain thick copper layers and for filling clearance holes in metal cores. The ceramic filler in the resin serves to reduce shrinkage and inhibit crack formulation during through-hole drilling in filled clearance areas.

Polymer Name: Polyimide (PI)

Functions: Prepreg

Technical Data Sheet
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Identification & Functionality

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Polymer Name
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Materials Features

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Properties

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Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Tensile Strength (MD)65Kpsi
Tensile Strength (CD)49Kpsi
Peel Strength to Copper (1 oz/35 micron) After Thermal Stress7.1 (1.2)lb/in (N/mm)IPC TM-650 2.4.8
Peel Strength to Copper (1 oz/35 micron) at Elevated Temperatures7.1 (1.2)lb/in (N/mm)IPC TM-650 2.4.8.2
Peel Strength to Copper (1 oz/35 micron) After Process Solutions7.1 (1.2)lb/in (N/mm)IPC TM-650 2.4.8
Young's Modulus4.1 (28.2)Mpsi (GPa)IPC TM-650 2.4.18.3
Poisson's Ratio0.18-ASTM D-3039
Physical Properties
ValueUnitsTest Method / Conditions
Specific Gravity1.65-ASTM D 792
Water Absorption (0.062)0.27%IPC TM-650 2.6.2.1
Thermal Properties
ValueUnitsTest Method / Conditions
Glass Transition Temperature (Tg) - TMA250°CIPC TM-650 2.4.24
Coefficient of Thermal Expansion (X,Y)16ppm/°CIPC TM-650 2.4.41
Coefficient of Thermal Expansion (Z) - Below Tg48ppm/°CIPC TM-650 2.4.24
Coefficient of Thermal Expansion (Z) - Above Tg150ppm/°CIPC TM-650 2.4.24
z-axis Expansion (50-260oC)1%IPC TM-650 2.4.24
Decomposition Temperature (Td, 5%)407°CIPC TM-650 2.3.41
Decomposition Temperature (Td) - Initial387°CIPC TM-650 2.3.41
T260min. 60minIPC TM-650 2.4.24.1
T288min. 60minIPC TM-650 2.4.24.1
T300min. 60minIPC TM-650 2.4.24.1
Thermal Conductivity0.25W/m/K
Electrical Properties
ValueUnitsTest Method / Conditions
Electrical Strength1451 (57.1)Volts/mil (kV/mm)IPC TM-650 2.5.6.2
Dielectric Constant (1 MHz)4.2-ASTM D 150
Dielectric Constant (1 GHz)4Multilayer ~ 50% RCIPC TM-650 2.5.5.9
Dissipation Factor (1 MHz)0.01-ASTM D 150
Volume Resistivity (C96/35/90)1.5 x 10^8MΩ-cmIPC TM-650 2.5.17.1
Volume Resistivity (E24/125)3.0 x 10^8MΩ-cmIPC TM-650 2.5.17.1
Surface Resistivity (C96/35/90)1.6 x 10^9IPC TM-650 2.5.17.1
Surface Resistivity (E24/125)1.6 x 10^8IPC TM-650 2.5.17.1
Dielectric Breakdownmin. 41kVIPC TM-650 2.5.6
Arc Resistance143secASTM D495
Flammability
ValueUnitsTest Method / Conditions
FlammabilityHB-UL 94

Regulatory & Compliance