Products

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

Greene, Tweed's Arlon® 1000, a tough, hig temperature, semi-crystalline thermoplastic, offers a unique combination of mechanical, thermal and chemical propertier. Arlon 1000 features superior compressive strength and minimum creep, as well as broad chemical resistance. Arlon is an excellent choice for applications such as valve seats and bushings greater abrasion resistance and lower wear and better fatigue properties than other thermoplastics.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

Arlon 45N is a tough, high Tg (175°C by DSC) multifunctional epoxy laminate and prepreg system designed for use in a variety of higher layer count MLB's. Processeable using conventional FR-4 conditions, 45N is supplied to meet the requirements of IPC-4101/24.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

Arlon 44N is a high resin content multifunctional (175°C) epoxy prepreg system with a proprietary micordisperse ceramic filler system. 44N is engineered for the filling of clearance holes in thin Metal cores such as 0.006" Copperinvar- Copper or via holes in sequentially laminated MLB designs. Based on Arlon's 45N, the 44N system is compatible with conventional epoxy lamination and fabrication.

45NK is a woven Kevlar® aramid fiber reinforced multifunctional epoxy laminate and prepreg systemengineered to provide in-plane CTE values as low as 6 ppm/°C for compatibility with leadless alumina ceramic chip carriers (LCCC's) and other low expansion SMT devices where control of laminate expansion is critical for solder joint reliability. 45NK exceeds the requirements of IPC 4101/50 (Type AFG).