Products

Arlon 25N and 25FR are woven fiberglass reinforced, ceramic-filled composite materials engineered for use in microwave and RF multilayer printed circuit boards. Combining a non-polar thermoset resin system with a controlled-expansion ceramic filler, 25N and 25FR offer low dielectric constant and loss combined with a low Thermal Coefficient of Dielectric Constant (TCEr) for signal stability over a wide ambient temperature range. Designed for use in multilayer packages, 25N and 25FR offer prepregs that are identical in chemical composition and physical properties with their copper clad laminates for a completely homogeneous finished package for optimal signal integrity.The low dielectric constant (Er) and loss properties, low thermal coefficient of dielectric constant (TCEr), and excellent physical stability characteristics offered by 25N and 25FR materials make them ideal for wireless and digital applications, such as cellular telephones, down converters, low noise amplifiers, antennas and other advanced des ign circuits.Processing for 25N and 25FR materials is consistent with processing for standard high temperature thermoset based printed circuit board substrates.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

Greene, Tweed's Arlon® 1000, a tough, hig temperature, semi-crystalline thermoplastic, offers a unique combination of mechanical, thermal and chemical propertier. Arlon 1000 features superior compressive strength and minimum creep, as well as broad chemical resistance. Arlon is an excellent choice for applications such as valve seats and bushings greater abrasion resistance and lower wear and better fatigue properties than other thermoplastics.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

Arlon® 1263 is a Polyetheretherketone (PEEK) product filled with carbon fiber. It can be processed by injection molding and is available in Europe or North America. Typical application: Military Applications.

Arlon® 1555 is a Polyetheretherketone (PEEK) product filled with carbon fiber and graphite fiber. It can be processed by injection molding and is available in Europe or North America. Primary characteristic: lubricated.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

Greene, Tweed offers precision plastic components for a variety of demanding, semiconductor applications. These components are made from a full range of high-performance plastic materials including Arlon® 1330. Ideal for applications requiring exceptional wear resistance and chemical compatibility, Arlon 1330 provides good dimensional stability without the addition of carbon fibers.

Greene, Tweed offers precision plastic components for a wide range of demanding medical and biotechnology applications. Arlon 1160, a high-performance, unfilled thermoplastic is ideal for applications requiring wear resistance, corrosion resistance and dimensional stability. Arlon 1160 is preferred over metal because it is lightweight, very nonconductive and autoclavable.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

Arlon® 2000 is a Polyetheretherketone (PEEK) product. It is available in Europe or North America. Primary characteristic: heat resistant.

Arlon® 3000 XT is a Polyetheretherketone (PEEK) product. It can be processed by injection molding and is available in Europe or North America. Primary characteristic: heat resistant.

Greene, Tweed offers precision plastic components for a variety of demanding semiconductor applications. These components are made from a full range of high-performance plastic materials including Arlon® 1260, which is ideal for applications requiring high impact, wear and chemical resistance.

Greene, Tweed offers precision plastic components for a variety of demanding semiconductor applications. These components are made from a full range of high-performance plastic materials including Arlon® 1287 LI, which is ideal for applications requiring exceptionally high physical properties, wear resistance and chemical compatibility.

Arlon® 2400 is a Polyetheretherketone (PEEK) product filled with glass fiber. It is available in Europe or North America. Primary characteristic: heat resistant.

Arlon® 1163 is a Polyetheretherketone (PEEK) product filled with glass fiber. It can be processed by injection molding and is available in Europe or North America. Typical application: Military Applications.