Products

Bondline 6959 is a dielectric semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive. It is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.

Bondline 2158 is a resilient tungsten and silver filled premixed and frozen epoxy. It provides good adhesion, low volume resistivity and thermal conductivity with an elevated cure.

Bondline 6968 is a dielectric semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive. It is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.

Bondline 2485 is a silver filled, electrically conductive epoxy adhesive. This premixed, frozen and solvent free adhesive is designed for microelectronic chip bonding.

Bondline 2156 is a resilient tungsten and silver filled premixed and frozen epoxy. It provides good adhesion, low volume resistivity and thermal conductivity.

Bondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.

Bondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.

Bondline 7247 is a premixed and frozen electronic grade epoxy adhesive. This low coefficient of expansion epoxy offers high reliability when bonding and sealing critical electronic instruments