- Applications:Semiconductor Manufacturing, Adhesives & Sealants, Appliances & Electronics
- Product Families:Other Adhesives & Sealants, Adhesives & Sealants
- Chemical Family:Epoxy & Epoxy Derivatives
Bondline 6959 is a dielectric semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive. It is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.