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CFOAM® 35 HTC graphite foam is a graphitized, lightweight, highly-oriented and open-cell carbon foam produced from mesophase pitch feedstock. CFOAM® 35 HTC graphite foam has exceptionally high thermal conductivity comparable to that of copper and aluminum with significant weight savings. In addition to its high thermal conductivity, CFOAM® 35 HTC also demonstrates high electrical conductivity, high strength and a low coefficient of thermal expansion. CFOAM® 35 HTC is also easily machinable, chemically inert, corrosion free, resistant to harsh environments, and resistive to oxidation up to 400°C.

Functions: Core Material

Core Type: Other Core Types

Chemical Family: Graphene & Graphites

    Knowde Enhanced TDS

    Identification & Functionality

    Chemical Family
    Composite Materials Functions

    Features & Benefits

    Labeling Claims
    Materials Features
    Features
    • High thermal conductivity per unit weight
    • Low coefficient of thermal expansion
    • High compressive strength
    • Lower weight relative to aluminum (1/6th) and copper heat sinks (1/22nd)
    • Inert in corrosive and harsh environments
    • Non-flammable in bulk form and oxidation resistant in most oxidizing atmospheres
    • Acoustic shielding
    Benefits
    • High thermal conductivity and high thermal diffusivity enables superior rate of heat dissipation in thermally critical applications
    • 22x lighter than copper and 6x lighter than aluminum
    • Inert characteristics enable high resistance to environmental degradation in challenging environments
    • Highly fire resistant

    Applications & Uses

    Applications

    We manufacture and produce CFOAM® 35 HTC at a scale, cost, and commercial output rate to penetrate already identified markets including, but not limited to:  

    • Thermal management heat sinks for LED lighting, reducing weight, and increasing life
    • Lightweight and efficient heat exchangers for commercial military aircraft
    • Industrial heat exchangers for enhanced thermal heat transfer in single or multi-phase industrial heat exchanger products
    • Electronics component cooling
    • Automotive applications providing enhanced cooling in a smaller, lighter weight unit
    • Solar improving photovoltaic panel efficiency

    Properties

    Physical Form
    Typical Properties
    ValueUnitsTest Method / Conditions
    Nominal Density0.4 – 0.6ccISO 12985-2
    Compressive Strength1.5 – 1.8MPaISO 18515
    Compressive Modulus100 – 400MPaISO 18512
    Tensile Strength0.9 – 1.0MPaISO 12986-2
    Shear Strength1.0 – 4.0MPaISO 12986-2
    Coefficient of Thermal Expansion2.0ppm/°CISO 14420
    Thermal Conductivity140 – 180W/m-KISO 12987
    Maximum Operational Use Temperature400.0°CEnvironment Dependent
    Electrical Resistance3 – 4milliohm-cmISO 11713
    Pore Volumemin. 65%Microscopy
    Mean Pore Size1200.0MicronsMicroscopy