Knowde Enhanced TDS
Identification & Functionality
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Features
- Solvent-free
- No cracks or holes when cured
- Good follow-up
- Fast curing
- High viscosity
- Suitable for thermal module
- Good adhesion
Applications & Uses
- Applications
- Curing Method
Hot Backing at 120°C, 30min.
Properties
- Typical Properties
Value | Units | Test Method / Conditions | |
Viscosity | 10000 - 50000 | mPa.s | - |
Volume Resistance | max. 2X10⁻³ | Ω-cm | - |