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Chem-Mat Technologies Inc. EC200LV

Chem-Mat Technologies Inc. EC200LV is the conductive adhesive and thermally conductive adhesive which is widely used in optoelectronics, general electronic motors, and the electrical and thermal conductivity products required by the industry. Such as integrated circuit bonding, LED chip bonding, fixing of automotive motor diodes, etc. EC200LV is also suitable for conductive and thermally conductive coating and bonding of metals, ceramics, glass and other materials.

Product Type: 1K (1 component) Adhesive, Conductive Adhesive, Solvent free (100% Solids) Adhesive

Compatible Substrates & Surfaces: Ceramic, Glass, Metal

    Knowde Enhanced TDS

    Identification & Functionality

    Features & Benefits

    Features
    • Solvent-free
    • No cracks or holes when cured
    • Good follow-up
    • Fast curing
    • High viscosity
    • Suitable for thermal module
    • Good adhesion

    Applications & Uses

    Compatible Substrates & Surfaces
    Curing Method

    Hot Backing at 120°C, 30min.

    Properties

    Typical Properties
    ValueUnitsTest Method / Conditions
    Viscosity10000 - 50000mPa.s-
    Volume Resistancemax. 2X10⁻³Ω-cm-