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DAP ID-40 is a general-purpose diallyl ortho-phthalate molding compound filled with Orlon. It is supplied in a granular form and can be easily molded using standard compression or transfer equipment. This type of compound is versatile and suitable for various molding applications.

Polymer Name: Diallyl Phthalate

Processing Methods: Compression Molding, Transfer Molding

End Uses: Connectors, Printed Circuit Boards, Terminal Blocks

Technical Data Sheet
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Identification & Functionality

Fillers Included
Polymer Name
Plastics & Elastomers Functions
Technologies

Features & Benefits

Key Features

It has excellent electrical properties and is unaffected by prolonged exposure to elevated temperature and 100% humidity. It is also resistant to solvents, acids, and alkalies. It has good flexural, compressive and tensile strength, and excellent post- mold shrinkage when compared to other Orlon molding compounds.

Applications & Uses

Plastics & Elastomers Processing Methods
Product Applications

High resistance to impact and shock makes it an excellent material for terminal and printed circuit boards, connectors, or other applications requiring impact and/or shock tolerance.

Properties

Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Impact Strength (Izod Notched)0.60 - 0.70ft-Ib/inch
Flexural Strength8-12,500psi
Compressive Strength18 - 30,000psi
Tensile Strength3,600 -5,000psi
Thermal Properties
ValueUnitsTest Method / Conditions
Thermal Expansion (-40 °C to 100 °C)4.2x10⁻⁵°C
Heat Distortion Temperature (at 18.6 kg/cm²)260.0°C
Dimensional Stabilitymax. 0.07%
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance100.0seconds
Dielectric Strength (Kv Step-by-Step, Dry)360.0volts/mil
Dielectric Strength (Kv Step-by-Step, Dry)340.0volts/mil
Dielectric Breakdown (Dry)60.0Kv
Dielectric Breakdown (Wet)45.0Kv
Dielectric Constant (at 1 KHz/1 MHz, Dry)3.2/3.1
Dielectric Constant (at 1 KHz/1 MHz, Wet)3.4/3.3
Dissipation Factor (1KHz/1MHz, Dry)0.020/0.013
Dissipation Factor (1KHz/1MHz, Wet)0.020/0.018
Volume Resistance (as is)min. 10¹⁰mega-ohms
Volume Resistance( at 70 °C, 30 Days 100% RH)10⁻⁴mega-ohms
Surface Resistance (as is)min. 10¹⁰mega-ohms
Surface Resistance( at 70 °C, 30 Days 100% RH)10⁴mega-ohms
Moisture Properties
ValueUnitsTest Method / Conditions
Water Absorption (at 50 °C,48 hours)0.35%
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Specific Gravity1.52
Bulk Factor3.0
Molding Pressure500 - 8,000psi
Molding Temperature135 - 190°C
Mold Shrinkage0.007 - 0.009in / in

Regulatory & Compliance

Certifications & Compliance