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Cosmic Epoxy E484-FDA

1 of 25 products in this brand
Cosmic Epoxy E484-FDA is a mineral-filled, glass-reinforced, electrical-grade epoxy molding compound supplied in granular form. It has received approval for direct food contact. Notably, it possesses outstanding mechanical strength and electrical properties, especially at high temperatures, and has met the rigorous NASA outgassing standards. This material is used in electrical hardware applications such as underwater connectors and other insulation needs.

Polymer Name: Epoxy Resins & Compounds

End Uses: Connectors, Electrical Insulation

Volume Resistivity: 100000000.0 - 100000000.0 Ohm-m

Flexural Strength: 130.91 - 130.91 MPa

Knowde Enhanced TDS

Identification & Functionality

Fillers Included
Plastics & Elastomers Functions
Technologies

Features & Benefits

Key Features

It has excellent mechanical strength and electrical properties, especially at high temperatures. It has passed NASA out-gassing tests.

Applications & Uses

Plastics & Elastomers End Uses
Product Applications

Used in electrical hardware applications such as underwater connectors and other insulation applications.

Properties

Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Flexural Strength19000psi
Flexural Modulus2.6 x 10⁶psi
Compressive Strength30000psi
Tensile Strength14000psi
Impact Strength (Izod Notched)0.6ft-lb / inch
Barcol Hardness65 - 75
Thermal Properties
ValueUnitsTest Method / Conditions
Heat Deflection Temperature260°C
Glass Transition Temperature (Tg)165°C
Thermal Conductivity10 x 10⁻⁴cal/sec/cm²/°C/cm
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance186seconds
Volume Resistancemin. 10¹⁰Ohm - cm
Surface Resistancemin. 1 x 10¹⁵Ohm - cm
Dielectric Strength (Kv Step-by-Step, Wet)350volts/mil
Dielectric Breakdown (Step-by-Step, Wet)60Kv
Dielectric Constant (at 1 KHz, Wet)5.4
Dissipation Factor (at 1KHz, Wet)0.011
Dielectric Constant (at 1 MHz, Wet)4.7
Dissipation Factor (at 1MHz, Wet)0.008
Moisture Properties
ValueUnitsTest Method / Conditions
Water Absorption (at 50 °C,48 hours)0.25%
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Specific Gravity1.95
Bulk Factor2.0 - 5.0
Molding Pressure500 - 8,000psi
Molding Temperature150 - 180°C
Mold Shrinkage0.002 - 0.004In / In

Regulatory & Compliance

Certifications & Compliance