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Crosslink Technologies XR61406

Crosslink Technologies XR61406 is a low density epoxy casting system. product is recommended for reducing weight, when casting and potting small electronic modules. Product is suitable for operating in environments from -40c. to +120c.

Polymer Name: Epoxy Resins & Compounds

Processing Methods: Potting

End Uses: Electrical Components, Electrical/Electronic Applications, Encapsulant

Volume Resistivity: 2050000000000.0 - 2050000000000.0 Ohm-m

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Plastics & Elastomers Functions
Technologies

Features & Benefits

Materials Features

Applications & Uses

Cure Method
Plastics & Elastomers Processing Methods

Properties

Sales Specifications
ValueUnitsTest Method / Conditions
Viscosity3000 - 6000cps
Specific Gravity0.69 - 0.75g/cm³
Electrical Properties
ValueUnitsTest Method / Conditions
Dielectric Constant at 1 KHz3
Dissipation Factor at 1 KHz0.02
Dielectric Strength (62 Mil/Section)430Volts/Mil
Volume Resistivity2.05 x10^14Ohm/Cm
Cured Properties
ValueUnitsTest Method / Conditions
Density0.74gm/Cm³
Hardness70Shore D
Guide To Operating Temperature120°C
Linear Shrinkage0.0002In/InAstm D 2566
Tensile Strength4500PsiAstm D 638
Tensile Elongation9%Astm D 638
Coefficient of Thermal Expansion40X10^-6in/in/°C
Thermal Conductivity4.1X10^-4Cal/Sec.Cm.°C
Moisture Absorption0.4%
Flextural Strength5500Psi
Handling Properties
ValueUnitsTest Method / Conditions
Mix Ratio By Weight (by vol. 100:9.0)100:12.0
Mixed Viscosity at 22°C2000cps
Pot Life Of 200 gm. mass at 22°C35minutes
Gel Time Of 200 gm. mass at 22°C45minutes

Technical Details & Test Data

Cure Schedule
  • Recommended Cure Schedule at 22 °C - 48 Hrs
  • Alternate Cure Schedule at 60 °C - 4 Hrs.

Storage & Handling

Shelf Life

12 Months