Products

CTECH™ 10-201-1A is patent pending, 100% solids UV curable products that can be used to bond together many different types of substrates; including almost all plastics, metals and ceramics. With this proprietary technology the rapid processing advantages of UV curing can now be used with opaque and difficult to bond substrates. The materials cure immediately with UV exposure to crystal clear pressure sensitive films, coatings, beads and bondlines.

CTECH™ UV PSA 19-177-5A is proprietary one-part, solvent free adhesives that are processed at ambient temperatures. This distinguishes them from solvent carried or “UV hot melt” technologies offered by competition.

CTECH™ 7-111-2 has both UV/ Visible and low temperature cure systems to enable quick “fixture” of components by UV hardening of filets followed by rapid thermal cure of the shadowed areas. Alternatively, heat alone can be used. The material is thixotropic for easy dispensing and will stay on the part without spreading. The cured product is of low modulus but does not deflect greatly upon heating in order to bond disparate surfaces such as; gold, stainless steel, aluminum, “Alclad”, glass, ceramics and other oxide surfaces as well as FR4 surfaces.

CTECH™ 11-225-4A is high and low modulus variants, respectively, of UV curable adhesives that bond well to many substrates such as glass, ceramic, metal and plastics. These materials are UV curable with moderate cure speeds when exposed through clear bondlines or as encapsulants or in potting applications.

CTECH™ 11-226-1 is high and low modulus variants, respectively, of UV curable adhesives that bond well to many substrates such as glass, ceramic, metal and plastics. These materials are UV curable with moderate cure speeds when exposed through clear bondlines or as encapsulants or in potting applications.

CTECH™ 11-226-2 is high and low modulus variants, respectively, of UV curable adhesives that bond well to many substrates such as glass, ceramic, metal and plastics. These materials are UV curable with moderate cure speeds when exposed through clear bondlines or as encapsulants or in potting applications.