Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Base Chemicals Functions
- CASE Ingredients Functions
- Technologies
- Product Families
- Chemical Structure
- Dual cure mechanism
- Low chloride
- Multifunctional
- Low viscosity
- UV curable
Features & Benefits
- CASE Ingredients Features
Applications & Uses
- Markets
- Compatible Polymers & Resins
- Compatible Substrates & Surfaces
- Cure Method
- Adhesive & Sealant Type
- RECOMMENDED FORMULATION USE
CS-783 is recommended for use as an adhesion promoter to mold compounds and metal substrates. Typical addition levels are 1-5% of the total resin. CS-783 can also be used for standard epoxy curatives, catalysts, B-staged and/or hybrid adhesives.
Properties
- Physical Form
- Appearance
- Yellow liquid
- Typical Properties
Value | Units | Test Method / Conditions | |
Viscosity at 25°C (typical) | 400 | cP | Haake Rheometer |
Epoxy Functionality | 2-4 | — | — |
Methacrylate Functionality | 1-2 | — | — |
Molecular Weight | approx. 783 | daltons | — |
Epoxy Equivalent Weight | approx. 261 | — | — |
Recommended Storage Temp | 5+°C or below or below | °C | — |