- Product Type:2K (2 component) Adhesive, Adhesive
- Application Area:Optoelectronics Devices, Medical Applications, Optical Applications
- Compatible Substrates & Surfaces:Plastics, Metal, Glass, Wood, Ceramic
- Cure Method:Air Dry
- Chemical Family:Epoxy & Epoxy Derivatives
EPOXIBOND™ EB-119SP is unfilled, low viscosity, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates. It has long pot-life and has an amber color change upon cure.