Products

UB-50 is a clear, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent bond to metals, ceramics, and many plastics used in medical industry such as acrylic, polycarbonate, PVC etc. They also have excellent water resistance, and are exceptionally resistant to thermal shock. They can be used as an adhesive or for potting, casting and encapsulating applications.

UC-2350 is a two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows for easy flow and air release and excellent hydrolytic stability. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.

UC-2356 is a two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows for easy flow and air release and excellent hydrolytic stability. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.

EC-1015 is a low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

EB-316M is a semi-rigid, high strength structural epoxy adhesive. This tough adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance medical grade epoxy adhesive passes 500 thermal cycles from -50°C to 150°C. EB-316M is excellent for cryogenic temperature applications.

FLASHBOND™ UV-6502CL is a low viscosity, high clarity, light curing epoxy adhesive that offers excellent strength wetting properties. UV-6502CL cures to a clear polymer and maintains clarity at elevated temperatures. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cures best in the UVA wavelengths (315-365nm).

EB-316TC-2 is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer, medical or optics.

EC-1012MFR-HT is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

EPOXICAST-1006/EH-24 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. The cured system provides excellent resistance to moisture, most organic solvents and inorganic chemicals.

EB-316TM is a thixotropic version of EB-316M, a high strength, semi-rigid epoxy adhesive. This tough adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance medical grade epoxy adhesive passes 500 thermal cycles from - 50°C to 150°C. EB-316M is excellent for cryogenic temperature applications.

EB-142HT-1 is unfilled, low viscosity, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates.

EC-1009 is a pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

UC-2524 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.

UC-2521 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.

EB-430-1HT is a highly versatile epoxy adhesive formulated for semiconductor industry. An easy to dispense liquid paste, it offers high heat transfer, low shrinkage and a coefficient of thermal expansion comparable to that of copper and aluminum. This adhesive is designed for protecting IC's in TAB, as well as glob-top encapsulant for COB placement. Other applications include fabricating heat sinks, bonding semiconductors and transistors to heat sinks and general-purpose bonding of electronic components.

EC-1006M-4 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.

UXP-052107-1 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release.

EB-126HT is two components, clear epoxy system. This long work life, low viscosity resin system is designed for the bonding, coating, sealing, and impregnation of electrical and structural components. The cured system has excellent electrical and physical properties above 250°C with outstanding high temperature stability. It also provides excellent moisture, chemical, and corrosion resistance as well as resistance to thermal and mechanical shock.

EC-1850FT with EH-10E Hardener is a very low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

EC-1012M/EH-20M is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

EC-1030FL is a 2 component, flexible, high temperature epoxy potting compound. EC-1030FL offers an open work time at room temperature and cures at elevated temperatures. EC-1030FL can withstand temperatures of over 175°C and stays flexible at very low temperatures.

UV-5403S is a filled, low shrinkage, light curing epoxy adhesive that offers low CTE and high bonds strength. UV-5403S cures to a high bond strength polymer with excellent adhesive to metals, ceramics, and glass. This epoxy was specifically designed as a glob top encapsulant for smart card applications and encapsulations of chip modules. UV-5403S is free of solvents, has high ionic purity, and is resistant to moisture and humidity. This epoxy cures quickly under LED and UVA light.

SC-550-LV-RT is a 100% silicone solid elastomer designed for electronic potting applications. This two-component, room temperature curing system offers a hard, self-bonding, thermally conductive, low modulus material that is readily re-workable.

UV-8403 is a low viscosity, light curing epoxy adhesive that bonds well to a wide variety of substrates including engineered plastics such as UltemTM, LexanTM, and ABS. This product exhibits good surface wetting and adhesion to glass and many plastics. UV-8403 cures to a clear polymer when properly cured. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of UVA light (310-365nm).

SC-550-LV-TC-1 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-1 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

UV-8311 is a low viscosity, fast curing, light curing epoxy adhesive that offers excellent strenth wetting properties. UV-8311 cures to a high Tg, rigid polymer with excellent adhesive to metals, ceramics, and glass.This product requires direct light exposure during cure. UV-8311 can cure fully in under 10 seconds using optimal cure conditions. Due to the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cures best in the UVA wavelengths

UB-907FL is a two-component, industrial grade polyurethane adhesive system. Once cured, it forms a highly flexible bond line which provides peel and shear strength. It is deal for bonding a variety of metals, as well as plastics, glass, wood, and more. Can also be used for potting and encapsulating strain and heat sensitive electronic components.

SC-454M-6 is a thermally conductive, low viscosity, condensation cure, RTV silicone potting or encapsulating compound. It is readily pourable and can cure at room temperature. The cured resin has a very good flexibility with excellent electrical properties and high temperature resistance.

SC-550-LV-TC-2 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-2 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

SC-417 is a two-part, low viscosity, clear silicone which will cure at room temperature or at elevated temperatures. The cured elastomer is suited for electrical/electronic potting and encapsulating applications and provides environmental protection. It is readily pourable and can cure from room temperature to 200°C. The cured resin has a very good flexibility with excellent electrical properties and high temperature resistance.

EPOXIBOND™ EB-177 is a low viscosity, high Tg, two part epoxy that can be used for potting, encapsulating, or bonding. It is used highly in the medical, optical, and semiconductor industries.EB-177 has excellent high temperature resistance at 300°C and excellent solvent, chemical, and moisture resistance including gamma rays, autoclave, and ETO. It is an excellent choice for semiconductor applications including capillary under fill or flipchip die attach.

EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.

EP-207 is two parts, ambient temperature-cure, epoxy potting and encapsulating system. This semi-rigid system has excellent shock & vibration resistance and good thermal conductivity.

FLASHBOND™ UV-3607HTis a 1-component, UV/Thermal cure adhesive & sealant. This material can cure under moderate intensity UV light as well as elevated temperatures for shadowed areas. Its low viscosity is ideal for coating, capillary action, and doming applications. Unlike traditional dual cure epoxy systems which need light + heat, UV-3607HT can cure either with UV/LED light or with heat.

UVX‐070219 is a low viscosity, fast curing urethane acrylate that bonds well to engineered plastics and metal substrates. This product requires direct UV exposure during cure. Because of the variability of different UV light sources it is suggested that the user test and specify UV intensity and exposure time. This material is specially formulated to have reduces surface tack due to oxygen inhibition.

EPOXIBOND™ EB-135LP is a clear epoxy adhesive designed for electronic, optical, medical, and general applications and for casting of small electrical components. This epoxy system has 2 to 1 mixing ratio by volume & cure fast at moderate temperature. The cured adhesive gives high impact and bond strength. It can be used for bonding glass, metals, woods and some plastics.