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FLASHBOND™ UV-5403S

1 of 13 products in this brand
UV-5403S is a filled, low shrinkage, light curing epoxy adhesive that offers low CTE and high bonds strength. UV-5403S cures to a high bond strength polymer with excellent adhesive to metals, ceramics, and glass. This epoxy was specifically designed as a glob top encapsulant for smart card applications and encapsulations of chip modules. UV-5403S is free of solvents, has high ionic purity, and is resistant to moisture and humidity. This epoxy cures quickly under LED and UVA light.

Product Type: Epoxy Adhesive, Radiation Curable Coating

Application Area: Chip Module

Compatible Substrates & Surfaces: Ceramic, Glass, Metal

Cure Method: Radiation Cure

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet
  • TypeDocument Name
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Labeling Claims
Product Features
  • RoHS& REACH Compliant
  • Halogen Free (IEC 61249-2-21)
  • High Bond Strength
  • Fast UV/LED Cure

Applications & Uses

Application Area
Compatible Substrates & Surfaces
Cure Method
Product Applications
  • Glop Top
  • Dam & Fill
  • General Encapsulant

Properties

Appearance
Off White
Typical Properties
ValueUnitsTest Method / Conditions
Optimal Wavelength (LED, UVA)365nm
Optimal Intensity100 - 300 mW/cm2
Uncured Properties
ValueUnitsTest Method / Conditions
Viscosity (at 25°C)5,000 to 8,000cPs
Density (at 9/mL)1.37
Typical Cured Properties
ValueUnitsTest Method / Conditions
Glass Transition Temperature (Tg)72°C
Hardness78Shore D
Ultimate Tensile Strength5000psi
Elongation at Break1 - 3%
Operating Temperature Range-55 to 150°C
Volume Resistivity1x10^14Ω-cm

Regulatory & Compliance

Certifications & Compliance

Packaging & Availability

Available Packaging
  • Syringes
  • Bulk

Storage & Handling

Shelf Life
6 Months