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ESSENTIUM HTN-Z

1 of 17 products in this brand
Essentium HTN-Z (high-temperature nylon) is the ESD-safe version in our HTN line of materials. This material is designed for use in medium-duty electronics manufacturing. The HTN line has improved mechanical and thermal properties compared to standard nylons. Additionally, it is an easy-to-print, low-warp material that boasts high toughness and wear resistance. This material is a drop-in replacement for ESD-safe Acetal (Delrin®) and has best-in-class slow moisture absorption.

Polymer Name: Polyamide (unspecified)

End Uses: Electrical Components, Electrical Housing

Density: 1200.0 - 1200.0 kg/m³

Technical Data SheetSafety Data Sheet

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Identification & Functionality

Chemical Family

Polyamides

Polymer Name

Polyamide (unspecified)

Technologies

Plastics

Product Families

Plastics — 3D Printing Polymers

Thermoplastic Filament

Features & Benefits

Materials Features

ESD Protection,

Excellent Solvent Resistance,

Excellent Toughness,

Good Mechanical Properties,

Good Printability,

Good Thermal Stability,

High Strength,

High Temperature Resistance,

Low Warpage,

Wear Resistant

KEY FEATURES

• ESD-safe
• Solvent resistance
• Good temperature resistance
• Higher strength than PCTG, ABS, and Nylons

Applications & Uses

Plastics & Elastomers End Uses

Electrical Components,

Electrical Housing

APPLICATIONS INCLUDE

• Assembly aids for electronics
• ESD-safe fixtures
• ESD-safe electrical housings
• Part trays for electronics manufacturing

Properties

Physical Form

Filament

Material Specific Properties
ValueUnitsTest Method / Conditions
Specific Gravity1.2g/cm3ISO 1183

Technical Details & Test Data

MECHANICAL PROPERTIES
Metric Test Method Print Orientation
XY 45/45 YX ZX
Ultimate Tensile Strength, MPa ISO 527-2 72.8 (0.4) 63.3 (4.6) 63.1 (1.6) 56.7 (1.1)
Tensile Modulus, GPa ISO 527-2 3.45 (0.44) 3.49 (0.13) 3.23 (0.14) 2.86 (0.03)
Strain at Break, % ISO 527-2 120 (25) 2.3 (0.3) 4.1 (0.1) 3.1 (0.5)
Flexural Strength, MPa ISO 178 134 (2) 121 (3) 90.0 (6.6) 97.6 (0.8)
Flexural Modulus, GPa ISO 178 3.73 (0.24) 2.93 (0.03) 2.77 (0.19) 2.29 (0.13)
Izod Impact Strength, Notched kJ/m2 ISO 180 3.6 (0.5) 3.8 (0.8) 4.6 (0.4) 3.4 (0.5)

 

Storage & Handling

MATERIAL HANDLING AND DRYING

Essentium HTN-Z is a slightly hygroscopic thermoplastic and will absorb moisture from humid air. Keep the material in the vacuum sealed packaging until you are ready to print with it. HTN filament should always be fed to the printer in a dry container and stored in a dry cabinet. If the material does absorb more than 400ppm moisture, it should be dried in a low dew point (< -40˚C) oven or vacuum oven at 130˚C for 6 – 8 hours.

RECOMMENDED HSE PRINT SETTINGS

0.4mm Hozzle

Extrusion Width, mm 0.35 – 0.5
Layer Height, mm 0.15 –0.25
Print Speed, mm/s 50 – 500
Infill, % 15 – 75
Hozzle Temperature, ˚C 260 – 420
Bed Temperature, ˚C 70 – 80
IR Temperature, ˚C 20 – 40
Fan Speed, % 10 – 30

0.8mm Hozzle

Extrusion Width, mm 0.75 – 0.9
Layer Height, mm 0.3 –0.35
Print Speed, mm/s 10 – 160
Infill, % 15 – 75
Hozzle Temperature, ˚C 270 – 460
Bed Temperature, ˚C 70 – 80
IR Temperature, ˚C 20 – 40
Fan Speed, % 10 – 30

 RECOMMENDED FDM PRINT SETTINGS

Nozzle Temperature, ºC 270 – 290
Bed Temperature, ºC 70 – 80
Print Speed, mm/s 20 – 60
First Layer Speed, mm/s 15 – 20
Fan Speed, % 0 – 20
Bed Material G-10/FR4 or Glass
Bed Adhesion Method Magigoo® PA or PVA glue
Infill Density, % <75