Products

Etna Tec Limited SCD 1066 is a saturated, oil-free polyester resin designed for use in coil coating applications. It exhibits excellent flexibility and flow characteristics, as well as, excellent elongation for drawing. SCD 1066 may also used as a non-fugitive flexibilizing modifier for alkyds, polyesters, and 2K urethanes.

Etna Tec Limited TEC 3065 is a multifunctional acrylate based reactive diluent. It contains Etna-TEC’s (E-TEC) patented cure technology, which allows it to be thermally cured in the presence of oxygen. TEC 3065 is a low viscosity, 100% NVM liquid, and thus, contains no Volatile Organic Compounds (VOC).

Etna Tec Limited SCD 14786 is an oil-free saturated polyester resin supplied in EEP solvent. It is a high solids resin with additional carboxyl functionality designed to provide a combination of hardness, flexibility and adhesion. It is used to formulate low VOC coatings for metal deco, exterior container and aluminum extrusion coatings. It has also been used to formulate heat set inks used in the container industry.

Etna Tec Limited TEC 3570 is a multifunctional acrylate based reactive resin system. It contains Etna-TEC’s (E-TEC) patented cure technology, which allows it to be thermally cured in the presence of oxygen. TEC 3570 is a low viscosity, 100% NVM liquid, and thus, contains no Volatile Organic Compounds (VOC).

Etna Tec Limited TEC 3350 is a low viscosity 100% solids multi-functional acrylate liquid.

Etna Tec Limited SCD 1040 is designed specifically for low VOC finishes. Proper formulation achieves high pigment loading, VOC of less than 3.0 pounds/gallon and application with conventional spray equipment. SCD 1040 has good compatibility with alkyds and acrylics when used as a modifier to improve dry film properties.

Etna Tec Limited SCD 6150 offers the formulator good uncatalyzed cure response and high film hardness. Properly formulated it offers excellent corrosion resistance. SCD 6150 yields excellent film properties in solvent based high solid formulations and can improve the dry film properties of various resin systems as a modifier. It is often used as a non-fugitive adhesion promoter. This product utilizes the same base resin as in SCD 6120 except it is reduced in EEP to provide non-HAPS, low VOC formulations.

Etna Tec Limited TEC 3735 contains the same base resin as SCD 1066, except that it is supplied in PM Acetate, in place of 150 solvent.