Fielco Adhesives Odyssey

Fielco Adhesives Brand

Products:11

Odyssey line of adhesives are specifically formulated for your electronic encapsulating application. The table below lists the epoxy adhesives we currently formulate for electronic encapsulates.

View All Fielco Adhesives Odyssey Products

Odyssey 174

Applications:Equipment & Parts, Adhesives & Sealants, Appliances & Electronics
Product Families:Encapsulants, Adhesives & Sealants
Chemical Family:Epoxy & Epoxy Derivatives

Fielco Adhesives Odyssey 174 is a tough, two-part, epoxy encapsulate and transducer mounting adhesive.

Odyssey 1220

Applications:Adhesives & Sealants, Appliances & Electronics, Semiconductor Manufacturing
Product Families:Encapsulants, Adhesives & Sealants
Chemical Family:Epoxy & Epoxy Derivatives

Fielco Adhesives Odyssey 1220 is a general purpose, ambient curing, two-part epoxy potting compound for various electrical applications.

Odyssey 3125

Applications:Adhesives & Sealants, Appliances & Electronics, Semiconductor Manufacturing
Product Families:Encapsulants, Adhesives & Sealants
Chemical Family:Epoxy & Epoxy Derivatives

Fielco Adhesives Odyssey 3125 is an epoxy potting compound with excellent humidity, impact and abrasion resistance with service temperatures of 300°F.

Odyssey 6800

Applications:Adhesives & Sealants, Appliances & Electronics, Semiconductor Manufacturing
Product Families:Contact Adhesives, Adhesives & Sealants

Fielco Adhesives Odyssey 6800 is a heat curing, fast setting, one-part epoxy adhesive designed for bonding applications requiring heat dissipation.

Odyssey 6835

Applications:Adhesives & Sealants, Appliances & Electronics, Semiconductor Manufacturing
Product Families:Encapsulants, Adhesives & Sealants
Chemical Family:Anhydrides

Fielco Adhesives Odyssey 6835 is a semi-flexible, heat-curing anhydride-based potting compound for Class B electrical applications with excellent thermal shock and moisture resistance.

Odyssey 6840

Applications:Adhesives & Sealants, Appliances & Electronics, Semiconductor Manufacturing
Product Families:Encapsulants, Adhesives & Sealants
Chemical Family:Anhydrides

Fielco Adhesives Odyssey 6840 is a tough, heat-curing anhydride-based potting compound with excellent electrical properties and adhesion to metal coils and enclosures.

Odyssey 6850

Applications:Adhesives & Sealants, Appliances & Electronics, Semiconductor Manufacturing
Product Families:Encapsulants, Adhesives & Sealants

Fielco Adhesives Odyssey 6850 is an ambient curing potting compound that allows for the complete impregnation of small coils and components.

Odyssey 6860

Applications:Adhesives & Sealants, Appliances & Electronics, Printed Circuit Boards (PCBs)
Product Families:Encapsulants, Adhesives & Sealants
Chemical Family:Epoxy & Epoxy Derivatives

Fielco Adhesives Odyssey 6860 is a rapid setting, ambient curing epoxy potting compound for encapsulation of small circuit assemblies.

Odyssey 6870

Applications:Adhesives & Sealants, Appliances & Electronics, Semiconductor Manufacturing
Product Families:Encapsulants, Adhesives & Sealants

Fielco Adhesives Odyssey 6870 is an impact-resistant, fast-setting electronic potting compound well suited for high humidity environments.

Odyssey 13915

Applications:Adhesives & Sealants, Appliances & Electronics, Printed Circuit Boards (PCBs)
Product Families:Encapsulants, Adhesives & Sealants
Chemical Family:Epoxy & Epoxy Derivatives

Fielco Adhesives Odyssey 13915 is a fast-setting, ambient curing epoxy potting compound for the encapsulation of small circuit assemblies.

Odyssey 14146

Applications:Adhesives & Sealants, Appliances & Electronics, Semiconductor Manufacturing
Product Families:Encapsulants, Adhesives & Sealants
Chemical Family:Anhydrides

Fielco Adhesives Odyssey 14146 is a semi-flexible, heat curing anhydride-based electronic potting compound for Class B electrical applications with excellent thermal shock and impact resistance.

Knowde Brand Summary

Identification

Chemical Family: Anhydrides,
Epoxy & Epoxy Derivatives
Product Type: 1K (1 component) Adhesive,
2K (2 component) Adhesive,
Encapsulant,
Epoxy Adhesive,
Potting Compound
Technologies: Ready-to-Use Products
Product Families: Adhesives & Sealants
Contact Adhesives,
Encapsulants

Applications & Uses

Markets: Consumer Goods,
Electrical & Electronics,
Industrial
Applications: Appliances & Electronics
Chemical & Industrial Manufacturing
Equipment & Parts
Packaging & Assembly
Adhesives & Sealants
Parts & Components
Printed Circuit Boards (PCBs),
Semiconductor Manufacturing
Application Area: Mounting Applications
Compatible Substrates & Surfaces: Metal
Cure Method: Air Dry,
Heat Cure