Products

Fielco Adhesives Odyssey 6850 is an ambient curing potting compound that allows for the complete impregnation of small coils and components.

Fielco Adhesives Odyssey 6840 is a tough, heat-curing anhydride-based potting compound with excellent electrical properties and adhesion to metal coils and enclosures.

Fielco Adhesives Odyssey 6870 is an impact-resistant, fast-setting electronic potting compound well suited for high humidity environments.

Fielco Adhesives Odyssey 14146 is a semi-flexible, heat curing anhydride-based electronic potting compound for Class B electrical applications with excellent thermal shock and impact resistance.

Fielco Adhesives Odyssey 6835 is a semi-flexible, heat-curing anhydride-based potting compound for Class B electrical applications with excellent thermal shock and moisture resistance.

Fielco Adhesives Odyssey 3125 is an epoxy potting compound with excellent humidity, impact and abrasion resistance with service temperatures of 300°F.

Fielco Adhesives Odyssey 1220 is a general purpose, ambient curing, two-part epoxy potting compound for various electrical applications.

Fielco Adhesives Odyssey 6860 is a rapid setting, ambient curing epoxy potting compound for encapsulation of small circuit assemblies.

Fielco Adhesives Odyssey 6800 is a heat curing, fast setting, one-part epoxy adhesive designed for bonding applications requiring heat dissipation.

Fielco Adhesives Odyssey 174 is a tough, two-part, epoxy encapsulate and transducer mounting adhesive.

Fielco Adhesives Odyssey 13915 is a fast-setting, ambient curing epoxy potting compound for the encapsulation of small circuit assemblies.