THERMLfilm® HT™ 9000

Identification & Functionality

Product Type: Tape
Technologies: Ready-to-Use Products
Product Families: Ready-to-Use Products — Adhesives & Sealants
Pressure Sensitive Adhesives & Tapes

Features & Benefits

Benefits: 2 mil polyimide film withstands intermittent heat up to 750°F (398°C) and endures wave solder and printed circuit board cleaning environments

Tested and approved for leaded and lead free reflow (top and bottom) in the wave solder environmentAvailable on a variety of liners to meet your specific application and dispensing

requirements (9000 with 50 lb. glassine and 9001 with 1.5 mil polyester)

Halogen free; REACH and RoHS compliant

Thermal transfer printable (resin ribbons)

UL/cUL Recognized under UL 969 - UL File No. PGJI2.MH16635 Printing Materials - Component

Applications & Uses

Markets: Automotive & Transportation,
Consumer Goods,
Electrical & Electronics,
Healthcare & Pharma,
Industrial,
Printing & Packaging
Applications: Industrial — Chemical & Industrial Manufacturing
Equipment & Parts
Electrical & Electronics — Devices & Assemblies
Consumer Electronics
Healthcare & Pharma — Medical
Medical Devices & Assemblies
Automotive & Transportation — Other Automotive & Transportation Applications
Consumer Goods — Other Consumer Goods Applications
Electrical & Electronics — Parts & Components
Printed Circuit Boards (PCBs)
Printing & Packaging — Tapes, Labels & Adhesives
Tapes & Labels
Automotive & Transportation — Transportation
Aerospace & Aviation

Properties

Physical Properties
Adhesion Properties: Surface Dwell Time Average

Oz/in (N/m)

Aluminum 15 mins. 59 -649 ASTM D 903

24 hrs. 69 -759

Stainless Steel 15 mins. 44 -484

24 hrs. 51 -561

Service Temperature Range:

-40^{o} F to 356^{o} F (-40^{o} C to 180^{o} C)

Intermittent Up to 750°F (398°C) FLEXcon M29

5 min. Up to 500°F (260°C) applied to Panel

Expected Shear: Room Temp (hours) 50

ASTM D 3654 Method A
a. 1 hr. dwell

b. 1 sq. in. surface

c. 4 lb. load

	Value	Units	Test Method / Conditions
Film	2.0	mils	ASTM D 3652 (Modified for use with non-tape products)
Coating	0.6	mils	ASTM D 3652 (Modified for use with non-tape products)
Adhesive	1.45	mils	ASTM D 3652 (Modified for use with non-tape products)
Liner - 50 Glassine	2.7	mils	ASTM D 3652 (Modified for use with non-tape products)
Liner - 150 Polyester	1.4	mils	ASTM D 3652 (Modified for use with non-tape products)

Regulatory & Compliance

UL/cUL Recognized: Under UL 969 - UL File No. PGJI2.MH16635 Printing Materials - Component
UL/cUL Recognized Ribbons: UL/cUL: Dia Nippon R510HF, iimak SP575, ITW Coding Products 7993, Ricoh B110CR, and
Armor AXR 1
UL only: ITW Thermal Films B814
Compliance and Content: RoHS - Restriction of Hazardous Substances
(EU Directives 2002/95/EC and 2003/11/EC):
REACH - Registration, Evaluation and Authorization of Chemicals
SVHC - Substances of Very High Concern (EU Directive 1907/2006/EC):
Halogen Free IEC 61249-2-21:

Technical Details & Test Data

Special Considerations: All surfaces should be clean, dry and free of any surface contamination. IPA is the recommended cleaning solution.

We recommend exposing printed labels to high heat (302°F/150°C) prior to performance testing.

The printed surface should not be touched while hot. The resin TTR will be soft and will smudge or remove.

Test data is based on Laboratory test structure. Actual application testing should be done to confirm suitability for application.
Durability: Durability:

ANSI Scannability

Leaded Reflow Up to 7 washes 1

Testing conducted at

Lead Free Reflow Up to 7 washes 1

ITW Speedline Technologies

No Reflow Up to 7 washes 1

ZESTRON and KYZEN
Chemical Resistance: Chemical Resistance: Test Fluid

ANSI Scannability

1 part IPA, 3 parts Mineral Spirits 1 MIL-STD-202G

Terpene Defluxer 1

1 part IPA, 3 parts Mineral Spirits 1 MIL-STD-883E

Terpene Defluxer 1
Printed Circuit Board - Processing Parameters: Cleaning
Agent Cleaning
Agent Base Process Wash
Time Wash
Temperature
(^{o} F / ^{o} C) Rinse
Time Rinse
Temperature
(^{o} F / ^{o} C) Visual
Appearance

ATRON^{®} AC 205 Aqueous Spray in Air 2.6 min 150/ 65.6 2-3 min 140 / 60 No Change

ATRON^{®*} AC 207 Aqueous Spray in Air 2.6 min 150 / 65.6 2-3 min 140 / 60 No Change

Aquanox^{®} A4241 Aqueous Spray in Air 7.5 min 150 / 65.6 7.3 min 140 / 60 No Change

Aquanox^{®} ** A4625 Aqueous Spray in Air 2.6 min 150/ 65.6 2-3 min 140 / 60 No Change

Aquanox^{®} A4625B Aqueous Spray in Air 7.5 min 150/ 65.6 7.3 min 140 / 60 No Change

Aquanox^{®} A4638 Aqueous Spray in Air 7.5 min 150/ 65.6 7.3 min 140 / 60 No Change

Aquanox^{®} A4639 Aqueous Spray in Air 7.5 min 150/ 65.6 7.3 min 140 / 60 No Change

Aquanox^{®} * A4708 Solvent Spray in Air 7.5 min 150/ 65.6 7.3 min 140 / 60 No Change

HYDRON^{®} * WS 400
(high concentration 15%) Aqueous Spray in Air 2.6 min 150/ 65.6 2-3 min 140 / 60 No Change

HYDRON^{®} WS 400
(low concentration 5%) Aqueous Spray in Air 2.6 min 150/ 65.6 2-3 min 140 / 60 No Change

VIGON^{®} * A 201 Aqueous Spray in Air 2.6 min 150/ 65.6 2-3 min 150/ 65.6 No Change

VIGON^{®} N 600 Aqueous Spray in Air 2.6 min 150/ 65.6 2-3 min 140 / 60 No Change

VIGON^{®} N 680 Aqueous Spray in Air 2.6 min 150/ 65.6 2-3 min 140 / 60 No Change

VIGON^{®} PE 190 A Aqueous Spray in Air 2.6 min 150/ 65.6 2-3 min 140 / 60 No Change
Printed Circuit Board - Processing Results: LEAD FREE REFLOW
Cleaning
Agent Dia Nippon
R510HF♦ iimak
SP575 ITW Coding Products
7993 ITW Thermal
Films B814▲ Ricoh
B110CR

ATRON^{®*} AC 205 4 4 4 PR 4

ATRON^{®} AC 207 4 4 4 PR 4

Aquanox^{®*} A4241 4 NT NT 4 4

Aquanox^{®} A4625 4 4 4 NT NT

Aquanox^{®} A4625B 4 NT NT 4 4

Aquanox^{®} A4638 4 NT NT 4 4

Aquanox^{®} A4639 4 NT NT 4 4

Aquanox^{®} A4708 4 NT NT 4 4

HYDRON^{®} * WS 400 (high concentration 15%) 4 4 4 4 4

HYDRON^{®} WS 400 (low concentration 5%) 4 4 4 4 4

VIGON^{®*} A 201 4 4 4 PR 4

VIGON^{®} N 600 4 4 4 PR 4

VIGON^{®} N 680 4 4 4 4 4

VIGON^{®} PE 190 A 4 4 4 4 4

Rating: 4 = Passes 4 cleanings PR = Print Removal NT = Not Tested
♦Dia Nippon R510HF ribbon is recommended for non-reflow applications ▲ITW Thermal Films B814 is UL only
*ATRON®,, HYDRON® , and VIGON® are registered trademarks of ZESTRON Americas **Aquanox® is a registered trademark of KYZEN

LEAD FREE REFLOW
ATRON^{®} AC 205 NT 4 NT 4 NT NT NT NT

ATRON^{®*} AC 207 NT 4 NT 4 NT NT NT NT

Aquanox^{®} A4241 4 4 4 4 4 4 4 4

Aquanox^{®} * A4625 4 4 NT NT NT NT 4 NT

Aquanox^{®} A4625B 4 4 4 4 4 4 4 4

Aquanox^{®} A4638 4 4 4 4 4 4 4 4

Aquanox^{®} A4639 4 4 4 4 4 4 4 4

Aquanox^{®} A4708 4 4 4 4 4 4 4 4

HYDRON^{®} * WS 400
(high concentration 15%) NT 4 NT 4 NT NT NT NT

HYDRON^{®} WS 400
(low concentration 5%) NT 4 NT 4 NT NT NT NT

VIGON^{®} * A 201 NT 4 NT 4 NT NT NT NT

VIGON^{®} N 600 NT 4 NT 4 NT NT NT NT

VIGON^{®} N 680 NT 4 NT 4 NT NT NT NT

VIGON^{®} PE 190 A NT 4 NT 4 NT NT NT NT

Rating: 4 = Passes 4 Cleanings PR = Print Removal NT = Not Tested
Printed Circuit Board - Printability: Ribbon UL/cUL
Recognized Print Quality ANSI
Grade Scratch
Resistance Tape
Resistance

Armor AXR 1 Excellent A Excellent Excellent

Armor AXR 7+ Excellent A Excellent Excellent

Armor AXR 8 Excellent A Excellent Excellent

Armor AXR EL Excellent A Excellent Excellent

Dia Nippon R510HF • Excellent A Excellent Excellent

Dia Nippon TR4070

Excellent A Excellent Excellent

iimak SP575 • Excellent A Excellent Excellent

iimak SP330 Excellent A Excellent Excellent

IMP Z302 Excellent A Excellent Excellent

ITW Thermal Films B324

Excellent A Excellent Excellent

ITW Thermal Films B813

Excellent A Excellent Excellent

ITW Thermal Films B814▲ • Excellent A Excellent Excellent

ITW Coding Products 7993 • Excellent A Excellent Excellent

Ricoh B110CR • Excellent A Excellent Excellent

Zebra 5175 Excellent A Excellent Excellent

▲ITW Thermal Films B814 is UL only

Storage & Handling

Storage Stability: Two years when stored at 70°F (21°C) and 50% relative humidity
Minimum Application Temperature: Room temperature (65°F/18°C) is recommended

Surface	Dwell Time	Average
		Oz/in	(N/m)
Aluminum	15 mins.	59	-649	ASTM D 903
	24 hrs.	69	-759
Stainless Steel	15 mins.	44	-484
	24 hrs.	51	-561
Service Temperature Range:	-40^{o} F to 356^{o} F (-40^{o} C to 180^{o} C)
	Intermittent	Up to 750°F (398°C)		FLEXcon M29
	5 min.	Up to 500°F (260°C)		applied to Panel
Expected Shear:	Room Temp (hours)	50		ASTM D 3654 Method A a. 1 hr. dwell
				b. 1 sq. in. surface
				c. 4 lb. load

Durability:		ANSI Scannability
Leaded Reflow	Up to 7 washes	1	Testing conducted at
Lead Free Reflow	Up to 7 washes	1	ITW Speedline Technologies
No Reflow	Up to 7 washes	1	ZESTRON and KYZEN

Chemical Resistance:	Test Fluid	ANSI Scannability
	1 part IPA, 3 parts Mineral Spirits	1	MIL-STD-202G
	Terpene Defluxer	1
	1 part IPA, 3 parts Mineral Spirits	1	MIL-STD-883E
	Terpene Defluxer	1

Cleaning Agent	Cleaning Agent Base	Process	Wash Time	Wash Temperature (^{o} F / ^{o} C)	Rinse Time	Rinse Temperature (^{o} F / ^{o} C)	Visual Appearance
ATRON^{®} AC 205	Aqueous	Spray in Air	2.6 min	150/ 65.6	2-3 min	140 / 60	No Change
ATRON^{®*} AC 207	Aqueous	Spray in Air	2.6 min	150 / 65.6	2-3 min	140 / 60	No Change
Aquanox^{®} A4241	Aqueous	Spray in Air	7.5 min	150 / 65.6	7.3 min	140 / 60	No Change
Aquanox^{®} ** A4625	Aqueous	Spray in Air	2.6 min	150/ 65.6	2-3 min	140 / 60	No Change
Aquanox^{®} A4625B	Aqueous	Spray in Air	7.5 min	150/ 65.6	7.3 min	140 / 60	No Change
Aquanox^{®} A4638	Aqueous	Spray in Air	7.5 min	150/ 65.6	7.3 min	140 / 60	No Change
Aquanox^{®} A4639	Aqueous	Spray in Air	7.5 min	150/ 65.6	7.3 min	140 / 60	No Change
Aquanox^{®} * A4708	Solvent	Spray in Air	7.5 min	150/ 65.6	7.3 min	140 / 60	No Change
HYDRON^{®} * WS 400 (high concentration 15%)	Aqueous	Spray in Air	2.6 min	150/ 65.6	2-3 min	140 / 60	No Change
HYDRON^{®} WS 400 (low concentration 5%)	Aqueous	Spray in Air	2.6 min	150/ 65.6	2-3 min	140 / 60	No Change
VIGON^{®} * A 201	Aqueous	Spray in Air	2.6 min	150/ 65.6	2-3 min	150/ 65.6	No Change
VIGON^{®} N 600	Aqueous	Spray in Air	2.6 min	150/ 65.6	2-3 min	140 / 60	No Change
VIGON^{®} N 680	Aqueous	Spray in Air	2.6 min	150/ 65.6	2-3 min	140 / 60	No Change
VIGON^{®} PE 190 A	Aqueous	Spray in Air	2.6 min	150/ 65.6	2-3 min	140 / 60	No Change

LEAD FREE REFLOW	Cleaning Agent	Dia Nippon R510HF♦	iimak SP575	ITW Coding Products 7993	ITW Thermal Films B814▲	Ricoh B110CR
	ATRON^{®*} AC 205	4	4	4	PR	4
	ATRON^{®} AC 207	4	4	4	PR	4
	Aquanox^{®*} A4241	4	NT	NT	4	4
	Aquanox^{®} A4625	4	4	4	NT	NT
	Aquanox^{®} A4625B	4	NT	NT	4	4
	Aquanox^{®} A4638	4	NT	NT	4	4
	Aquanox^{®} A4639	4	NT	NT	4	4
	Aquanox^{®} A4708	4	NT	NT	4	4
	HYDRON^{®} * WS 400 (high concentration 15%)	4	4	4	4	4
	HYDRON^{®} WS 400 (low concentration 5%)	4	4	4	4	4
	VIGON^{®*} A 201	4	4	4	PR	4
	VIGON^{®} N 600	4	4	4	PR	4
	VIGON^{®} N 680	4	4	4	4	4
	VIGON^{®} PE 190 A	4	4	4	4	4

Ribbon	UL/cUL Recognized	Print Quality	ANSI Grade	Scratch Resistance	Tape Resistance
Armor AXR 1		Excellent	A	Excellent	Excellent
Armor AXR 7+		Excellent	A	Excellent	Excellent
Armor AXR 8		Excellent	A	Excellent	Excellent
Armor AXR EL		Excellent	A	Excellent	Excellent
Dia Nippon R510HF	•	Excellent	A	Excellent	Excellent
Dia Nippon TR4070		Excellent	A	Excellent	Excellent
iimak SP575	•	Excellent	A	Excellent	Excellent
iimak SP330		Excellent	A	Excellent	Excellent
IMP Z302		Excellent	A	Excellent	Excellent
ITW Thermal Films B324		Excellent	A	Excellent	Excellent
ITW Thermal Films B813		Excellent	A	Excellent	Excellent
ITW Thermal Films B814▲	•	Excellent	A	Excellent	Excellent
ITW Coding Products 7993	•	Excellent	A	Excellent	Excellent
Ricoh B110CR	•	Excellent	A	Excellent	Excellent
Zebra 5175		Excellent	A	Excellent	Excellent

Knowde Enhanced TDS