Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
Features & Benefits
- Benefits
- 1 mil polyimide film withstands intermittent heat up to 750°F (398°C) and endures wave solder and printed circuit board cleaning environments
- Tested and approved for leaded and lead free reflow (top and bottom) in the wave solder environment
- Available on a variety of liners to meet your specific application and dispensing
- requirements (9002 with 50 lb. glassine and 9003 with 1.5 mil polyester)
- Halogen free; REACH and RoHS compliant
- Thermal transfer printable (resin ribbons)
- UL/cUL Recognized under UL 969 - UL File No. PGJI2.MH16635 Printing Materials - Component
Applications & Uses
- Markets
- Applications
- Product Performance and Suitability
All of the descriptive information, the typical performance data, and recommendations for the use of FLEXcon products shall be used only as a guide and do not reflect the specification or
specification range for any particular property of the product. Furnishing such information is merely an attempt to assist you after you have indicated your contemplated use and shall in no event constitute a warranty of any kind by FLEXcon. All purchasers of FLEXcon products shall be responsible for independently determining the suitability of the material for the purpose for which it is purchased. No distributor, salesman, or representative of FLEXcon is authorized to give any warranty, guaranty, or make any representation in addition or contrary to the above.
Properties
- Physical Properties
- Adhesion Properties
Surface Dwell Time Average Oz/in (N/m) Aluminum 15 mins. 59 -649 ASTM D 903 24 hrs. 69 -759 Stainless Steel 15 mins. 44 -484 24 hrs. 51 -561 Service Temperature Range: -40^{o} F to 356^{o} F (-40^{o} C to 180^{o} C)Intermittent Up to 750°F (398°C)FLEXcon M-29 5 min. Up to 500°F (260°C)applied to Panel Expected Shear: Room Temp (hours) 50 ASTM D 3654 Method A
a. 1 hr. dwellb. 1 sq. in. surfacec. 4 lb. load
Value | Units | Test Method / Conditions | |
Film | 1.0 | mils | ASTM D 3652 (Modified for use with non-tape products) |
Coating | 0.6 | mils | ASTM D 3652 (Modified for use with non-tape products) |
Adhesive | 1.45 | mils | ASTM D 3652 (Modified for use with non-tape products) |
Liner - 50 Glassine | 2.7 | mils | ASTM D 3652 (Modified for use with non-tape products) |
Liner - 150 Polyester | 1.4 | mils | ASTM D 3652 (Modified for use with non-tape products) |
Regulatory & Compliance
- UL/cUL Recognized
Under UL 969 - UL File No. PGJI2.MH16635 Printing Materials - Component
UL/cUL Recognized Ribbons: UL/cUL: Dia Nippon R510HF, iimak SP575, ITW Coding Products 7993, Ricoh B110CR, and
Armor AXR 1
UL only: ITW Thermal Films B814- Compliance
RoHS - Restriction of Hazardous Substances
(EU Directives 2002/95/EC and 2003/11/EC): None of the substances named in these directives are knowingly used or intentionally added during the manufacturing process
REACH - Registration, Evaluation and Authorization of Chemicals
SVHC - Substances of Very High Concern (EU Directive 1907/2006/EC):None of the substances currently on the Candidate List are knowingly used or intentionally added during the manufacturing process
Halogen Free IEC 61249-2-21: Halogens are not knowingly used or intentionally added during the manufacturing process
Technical Details & Test Data
- Special Considerations
- All surfaces should be clean, dry and free of any surface contamination. IPA is the recommended cleaning solution.
- We recommend exposing printed labels to high heat (302°F/150°C) prior to performance testing.
- The printed surface should not be touched while hot. The resin TTR will be soft and will smudge or remove.
- Test data is based on Laboratory test structure. Actual application testing should be done to confirm suitability for application.
- Durability
Durability ANSI ScannabilityLeaded Reflow Up to 7 washes 1 Testing conducted atLead Free Reflow Up to 7 washes 1 ITW Speedline TechnologiesNo Reflow Up to 7 washes 1 ZESTRON and KYZEN- Printed Circuit Board - Processing Parameters
Cleaning
AgentCleaning
Agent BaseProcess Wash
TimeWash
Temperature
(^{o} F / ^{o} C)Rinse
TimeRinse
Temperature
(^{o} F / ^{o} C)Visual
AppearanceATRON^{®} AC 205 Aqueous Spray in Air 2.6 min 150/ 65.6 2-3 min 140 / 60 No Change ATRON^{®*} AC 207 Aqueous Spray in Air 2.6 min 150 / 65.6 2-3 min 140 / 60 No Change Aquanox^{®} A4241 Aqueous Spray in Air 7.5 min 150 / 65.6 7.3 min 140 / 60 No Change Aquanox^{®} ** A4625 Aqueous Spray in Air 2.6 min 150/ 65.6 2-3 min 140 / 60 No Change Aquanox^{®} A4625B Aqueous Spray in Air 7.5 min 150/ 65.6 7.3 min 140 / 60 No Change Aquanox^{®} A4638 Aqueous Spray in Air 7.5 min 150/ 65.6 7.3 min 140 / 60 No Change Aquanox^{®} A4639 Aqueous Spray in Air 7.5 min 150/ 65.6 7.3 min 140 / 60 No Change Aquanox^{®} * A4708 Solvent Spray in Air 7.5 min 150/ 65.6 7.3 min 140 / 60 No Change HYDRON^{®} * WS 400
(high concentration 15%)Aqueous Spray in Air 2.6 min 150/ 65.6 2-3 min 140 / 60 No Change HYDRON^{®} WS 400
(low concentration 5%)Aqueous Spray in Air 2.6 min 150/ 65.6 2-3 min 140 / 60 No Change VIGON^{®} * A 201 Aqueous Spray in Air 2.6 min 150/ 65.6 2-3 min 150/ 65.6 No Change VIGON^{®} N 600 Aqueous Spray in Air 2.6 min 150/ 65.6 2-3 min 140 / 60 No Change VIGON^{®} N 680 Aqueous Spray in Air 2.6 min 150/ 65.6 2-3 min 140 / 60 No Change VIGON^{®} PE 190 A Aqueous Spray in Air 2.6 min 150/ 65.6 2-3 min 140 / 60 No Change - Printed Circuit Board - Processing Results
- LEAD FREE REFLOW
Cleaning
AgentDia Nippon
R510HF♦iimak
SP575ITW Coding Products
7993ITW Thermal
Films B814▲Ricoh
B110CRATRON^{®*} AC 205 4 4 4 PR 4 ATRON^{®} AC 207 4 4 4 PR 4 Aquanox^{®*} A4241 4 NT NT 4 4 Aquanox^{®} A4625 4 4 4 NT NT Aquanox^{®} A4625B 4 NT NT 4 4 Aquanox^{®} A4638 4 NT NT 4 4 Aquanox^{®} A4639 4 NT NT 4 4 Aquanox^{®} A4708 4 NT NT 4 4 HYDRON^{®} * WS 400 (high concentration 15%) 4 4 4 4 4 HYDRON^{®} WS 400 (low concentration 5%) 4 4 4 4 4 VIGON^{®*} A 201 4 4 4 PR 4 VIGON^{®} N 600 4 4 4 PR 4 VIGON^{®} N 680 4 4 4 4 4 VIGON^{®} PE 190 A 4 4 4 4 4 Rating: 4 = Passes 4 cleanings PR = Print Removal NT = Not Tested
♦Dia Nippon R510HF ribbon is recommended for non-reflow applications ▲ITW Thermal Films B814 is UL only
*ATRON®,, HYDRON® , and VIGON® are registered trademarks of ZESTRON Americas **Aquanox® is a registered trademark of KYZENLEAD FREE REFLOWATRON^{®} AC 205 NT 4 NT 4 NT NT NT NT ATRON^{®*} AC 207 NT 4 NT 4 NT NT NT NT Aquanox^{®} A4241 4 4 4 4 4 4 4 4 Aquanox^{®} * A4625 4 4 NT NT NT NT 4 NT Aquanox^{®} A4625B 4 4 4 4 4 4 4 4 Aquanox^{®} A4638 4 4 4 4 4 4 4 4 Aquanox^{®} A4639 4 4 4 4 4 4 4 4 Aquanox^{®} A4708 4 4 4 4 4 4 4 4 HYDRON^{®} * WS 400
(high concentration 15%)NT 4 NT 4 NT NT NT NT HYDRON^{®} WS 400
(low concentration 5%)NT 4 NT 4 NT NT NT NT VIGON^{®} * A 201 NT 4 NT 4 NT NT NT NT VIGON^{®} N 600 NT 4 NT 4 NT NT NT NT VIGON^{®} N 680 NT 4 NT 4 NT NT NT NT VIGON^{®} PE 190 A NT 4 NT 4 NT NT NT NT Rating: 4 = Passes 4 Cleanings PR = Print Removal NT = Not Tested
- Printed Circuit Board - Printability
Ribbon UL/cUL
RecognizedPrint Quality ANSI
GradeScratch
ResistanceTape
ResistanceArmor AXR 1 Excellent A Excellent Excellent Armor AXR 7+ Excellent A Excellent Excellent Armor AXR 8 Excellent A Excellent Excellent Armor AXR EL Excellent A Excellent Excellent Dia Nippon R510HF • Excellent A Excellent Excellent Dia Nippon TR4070Excellent A Excellent Excellent iimak SP575 • Excellent A Excellent Excellent iimak SP330 Excellent A Excellent Excellent IMP Z302 Excellent A Excellent Excellent ITW Thermal Films B324Excellent A Excellent Excellent ITW Thermal Films B813Excellent A Excellent Excellent ITW Thermal Films B814▲ • Excellent A Excellent Excellent ITW Coding Products 7993 • Excellent A Excellent Excellent Ricoh B110CR • Excellent A Excellent Excellent Zebra 5175 Excellent A Excellent Excellent ▲ITW Thermal Films B814 is UL only
Storage & Handling
- Storage Stability
Two years when stored at 70°F (21°C) and 50% relative humidity
Minimum Application Temperature: Room temperature (65°F/18°C) is recommended