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Sircon SPG-30B has a high heat transfer / heat dissipation effect because it has good followability to the gap and high adhesion.

Processing Methods: Compression Molding

End Uses: Appliances, Electrical Components, Electrical Insulation, Temperature Sensor

Features: Cold Resistance, Good Adhesion, Good Compressive Strength, Good Impact Strength, Good Thermal Conductivity, Heat Resistance, High Flowability, Vibration Damping

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Identification & Functionality

Chemical Family
Technologies

Features & Benefits

Features
  • Since it is a one-component type and non-curing type, no curing work is required.
  • It has low repulsive stress and protects electronic components and substrates from compression, vibration, and impact.
  • It retains the excellent properties of silicone rubber such as heat resistance, cold resistance, and electrical insulation .
  • Despite its low fluidity, it can be operated with a dispenser.
  • There is no risk of corroding metals such as copper and aluminum.
Merit
  • Sircon ® is a completely new type of silicone rubber product that has excellent thermal conductivity and flame retardancy, which are excellent in various properties peculiar to silicone rubber such as heat resistance and electrical insulation. It is mainly used for semiconductors such as transistors and ICs, various heaters, electronic components such as temperature sensors, electrical insulation, and heat dissipation / heat transfer spacers.
  • Sircon® compound type is a low-fluidity type high thermal conductivity silicone compound product. Simply apply it to the surface of the heating element and sandwich it between a heat sink or housing to evenly fill the heat transfer gap, demonstrating highly reliable heat transfer performance.

Applications & Uses

Plastics & Elastomers Processing Methods
How to use

We will propose a dispenser system suitable for the usage conditions.

Properties

Thermal Properties
ValueUnitsTest Method / Conditions
Thermal Conductivity3.1 3.1W/m.KHot disc method
Thermal Resistance (Gap: 0.5mm)1.3 1.3°C.cm 2/WASTM D5470
Thermal Resistance (Gap: 1.0mm)2.3
Typical Properties
ValueUnitsTest Method / Conditions
Specific Gravity3.2JIS K 6220
Viscosity 1.0 (1/s)2750.0Pa.sASTM D1824
Viscosity 0.5 (1/s)4600.0
Thermogravimetric Analysis (Heat Loss)0.05wt%(150 ℃, 24 hours)
Electrical Properties
ValueUnitsTest Method / Conditions
Volume Resistivity1x10^12Ω.mJIS K 6249

Packaging & Availability

Package Configuration
  • 30cc syringe
  • 325cc cartridge