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GS Polymers GSP 1502T-2

GS Polymers GSP 1502T-2 is a flame-retardant, thermally-conductive, flexible polyurethane potting system. The Part A and Part B components have a low mixed-viscosity that allows for good flow and substrate wetting during application.

Product Type: Potting Compound

Application Area: Printed Circuit Boards, Switches

Chemical Family: Polyurethanes (PU)

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Identification & Functionality

Chemical Family
Product Type

Features & Benefits

Materials Features
characteristics

The cured polyurethane elastomer will meet or exceed UL 94 V-0 at 0.250 inches (6.35 mm). Additionally, GSP 1502T-2 exhibits good physical strength, toughness, and electrical properties. This polyurethane system bonds very well to metal and plastic substrates and can be used in applications where adhesion is needed.
GSP 1502T-2 was specially formulated to minimize filler settling for extended shelf-life. The system contains no TDI or heavy metal catalysts (e.g. mercury, lead, etc.).
GSP 1502T-2 can be used in applications involving encapsulation or potting of electrical components such as printed circuit boards (PCB), ballast transformers and telecommunications. It is particularly ideal in applications where a low viscosity, rapid cure, thermal conductivity and flame-retardancy are required.

features

Low Mixed Viscosity
Flexible
Fa st curing
Good flow and wet-out
Good adhesion and thermal conductivity
Meets UL 94 V-0, 0.250 inches (6.35 mm)

Applications & Uses

Plastics & Elastomers End Uses
Applications

Printed circuit boards (PCBs)
Switches
Transformers
Miscellaneous potting of electrical components

INSTRUCTIONS FOR USE

SIDE-BY-SIDE (SBS) CARTRIDGE:
GSP 1502T-2 is not available in Side-By-Side packaging because the parts-by-volume ratio of the system is incompatible with standard SBS cartridges. Contact GS Polymers technical department for system recommendations if your application requires a cartridgeable system.
TO MIX BY HAND:
Mix Ratio: Parts by Weight (pbw): .................................15 parts GSP 1502T-2 Part A to 100 parts GSP 1502T-2 Part B
Pot-Life: Do not mix more than can be applied in 5 minutes. Gel time is about 10 - 20 minutes but will vary depending on the mass mixed and the ambient temperature.
Mixing: Proportion out components according to the parts by weight (pbw) ratio into a non-reactive container (e.g. polyethylene, polypropylene, or metal de-rimmed can). Select a container about five times larger than the volume of material mixed to allow for expansion while de-airing under vacuum. Mix components very thoroughly, preferably with a metal spatula, scraping the sides and bottom of container to incorporate all material.
De-Air: Remove air bubbles entrapped while mixing by placing mixed material in a vacuum chamber. (Vacuum should be able to achieve 29 inHg.) Liquid level should rise and then fall with some bubbling. Break vacuum partially and reapply as necessary to avoid overflow. De-air material until bubbling is minimal. Do not leave material under vacuum longer than one minute as catalysts may be stripped from the system and effect curing.
Transfer and Application: If working time allows, pour mixed material into a clean container without further scraping the sides and bottom. (In case unmixed material is still present.) Discard the residual material left behind in the mix container. If working time does not allow transfer to a clean container, dispense material taking care to avoid further scraping material from the sides and bottom of the mix container. Apply mixed material to the work area immediately.
Containers: After using materials, blanket remaining components under nitrogen gas (N2) and securely reseal the containers. This will reduce the likelihood of contamination from atmospheric moisture and extend shelf life.
CURING PROCEDURES:
Most properties (approx 90%) will develop after 48 hours of room temperature cure. Full properties develop over a period of 5 to 7 days at ambient temperature. Cure may be accelerated with the application of heat. To heat cure the system, allow product to gel at room temperature for one hour. Then apply moderate heat 60-85 °C (140-185° F) for 1 to 3 hours.

Properties

Flame Rating
Component A
ValueUnitsTest Method / Conditions
ColorAmber
Density10.3lb/gal
Density1.23g/cc
Viscosity At 70°F (21°C)150-250cps
Mix Ratio By Weight15
Gel Time At 300G10 - 20minutes
Fixture-Cure 60-90minutes
Recommended Full-Cure (1) Standard, 77°F (25°C)5-7days
Recommended Full-Cure (2) Alternate, Gel R.T. Plus 140-185°F (60-85°C)1-3hours
Physical Properties
ValueUnitsTest Method / Conditions
Hardness83 - 93Shore A
Tensile Strength,1500psi
Tensile Elongationmax.115
24 Hour Water Absorption0.15%
Dielectric Strength1150v/mil(ASTM D149-97a Method A)
Dielectric Constant At 100K Hz6
Volume Resistivity7.1E^13
Thermal Conductivity (W/M°K)0.6min
Thermal Conductivity ((Btu-In)/(Hr X Ft2 X ºF))3.5min
Flammability (0.250 Inches)UL94 V-0
Component B
ValueUnitsTest Method / Conditions
ColorOff-White
Density12.7lb/gal
Density1.52g/cc
Viscosity At 70°F (21°C)6000 - 8000cps
Mix Ratio By Weight100
Gel Time At 300G10 - 20minutes
Fixture-Cure 60-90minutes
Recommended Full-Cure (1) Standard, 77°F (25°C)5-7days
Recommended Full-Cure (2) Alternate, Gel R.T. Plus 140-185°F (60-85°C)1-3hours

Regulatory & Compliance

Certifications & Compliance

Storage & Handling

Shelf Life
6 Months
Storage

Store both Part A and Part B components between 65°F /18°C – 86°F/30°C in a clean, dry area. If stored below 68°F/ 20°C, allow the material to reach room temperature in the closed/sealed container prior to use. Both components should be blanketed with nitrogen after use to extend shelf-life and minimize moisture contamination during storage.