Products

HeBoFill® CL-SP 035* is a high-purity boron nitride powder with a very distinct crystal structure and single crystallites in the range of 35 pm. It is further characterized by its low density and intrinsic high thermal conductivity. Since large crystallites conduct heat much faster, it is predestined for use as a filler and additive in plastics. Thereby, their thermal conductivity is significantly increased, while simultaneously maintaining good electrical insulation.

HeBoFill® CL-SP 045 is a pure Boron Nitride powder with a coarse grain size distribution. Its average particle size is 45 μm. The extremely low specific surface area allows high filler loadings with a minimum viscosity increase. It is particularly suitable as a filler in polymers, allowing the thermal conductivity to be increased without affecting the electrically insulating properties.