HexPly

HexPly® M79/M79-LT is a hotmelt, thermosetting, low-exothermic epoxy resin matrix, specifically designed for prepreg applications at which short cure cycles below 100°C are required. M79/M79-LT can be used for manufacture of large industrial components, suitable for cure of thin and thick sections. M79/M79-LT exhibits a long out-life of 8 weeks at ambient conditions. M79 is supplied as moderate tack and M79-LT as low tack resin matrix.

HexPly® M21 is a high performance, very tough epoxy matrix for use in primary aerospace structures. It exhibits excellent damage tolerance, especially at high energy impacts. HexPly® M21 is a toughened epoxy resin system supplied with unidirectional or woven carbon or glass fibers. HexPly® M21 was developed as a controlled flow system to operate in environments up at 121°C (250°F).

HexPly® M76 is a versatile curing toughened epoxy resin that can be cured from 275ºF (135ºC) to 350ºF (177ºC), depending on service temperature requirements. HexPly® M76 is formulated for lower temperature autoclave or press mold processing. The recommended lay-up procedure for HexPly® M76 is HSP-L4. The recommended cure procedures are HSP-C5 (275ºF) or HSP-C1 (350ºF).

HexPly® 8552 is a high performance tough epoxy matrix for use in primary aerospace structures. It exhibits good impact resistance and damage tolerance for a wide range of applications. HexPly® 8552 is an amine cured, toughened epoxy resin system supplied with unidirectional or woven carbon or glass fibers. HexPly® 8552 was developed as a controlled flow system to operate in environments up to 121ºC (250ºF).

3501-6 is an amine cured epoxy resin system supplied with unidirectional or woven carbon or glass fibers. Typical reinforcement is continuous AS4 carbon filaments. 3501-6 was developed to operate in a temperature environment of up to 350°F (177°C). AS4/3501-6 is recommended for general purpose structural applications.

HexPly® M65 is a bismaleimide resin that cures via an addition reaction in a toughened two-phase thermoset matrix with no condensation by-products. HexPly® M65 is a controlled bimaleimide resin system designed for alternative processing capabilities such as co-curing over honeycomb core, compression molding, as well as standard autoclave processing. HexPly® M65 has improved tack levels and performs well for fiber placement applications.

HexPly® 913 is a proven modified epoxy matrix with a low temperature cure cycle which exhibits outstanding environmental resistance, whilst retaining good hot/wet mechanical performance. This versatile matrix system can be processed using a wide range of techniques according to the application and is capable of co cure with epoxy film adhesives. HexPly® 913 is a highly successful matrix used extensively in the aerospace industry for primary aircraft structures and helicopter blades.

HexPly® M34 is an epoxy system, specifically developed for low temperature curing of large structural components, particularly in industrial markets. HexPly® M34 is a self-extinguishing system, providing excellent fire-resistant properties, and meeting the German and French rail qualifications DIN 5510, S3-SR2-ST2 and NF F 16-101 (M2, F1). HexPly® M34 prepreg is ideal for manufacturing sandwich structures, providing excellent adhesion to PVC foam cores. HexPly® M34 exhibits a good shelf life at Room Temperature for a low temperature curing system.

HexPly® 200 is a phenolic resin used extensively in fire proof components such as engine cowlings, fire walls, rocket nozzles and exit gas cones. The low smoke density and very low toxicity during ignition meet the requirements of FAR 25 and ATS 1000-001 specifications. The HexPly® 200 system has excellent ablative resistance and is available in fabric reinforcements and single tows.

HexPly® 8551-7 is an amine-cured, toughened epoxy resin system supplied with unidirectional graphite fibers. Typical reinforcement is continuous IM7 (intermediate modulus) graphite filaments. HexPly® 8551-7 was developed to operate in a temperature environment of up to 200ºF (93ºC). IM7/8551-7 is an extremely damage-resistant system, recommended for structural applications requiring high strength, stiffness, and damage tolerance. Conventional thermoset resin processing equipment and techniques can be used to process IM7/8551-7 prepreg tape.

HexPly® 250 is a phenolic matrix widely used in honeycomb sandwich components for aircraft interior furnishings. The low smoke and low toxicity properties of 250 during ignition meet the requirements of FAR 25 and ATS 1000. HexPly® 250 prepreg is available in fabric reinforcements and single tows.

HexPly® F155 is a Resin Systems for Advanced Composites