Products

F161 is a structural, heat resistant and electrical grade epoxy formulation designed for autoclave curing. F161 is a high temperature, laminate grade epoxy resin with a 350°F (177°C) cure. F161 is unique in that it was the first resin system to meet all types and classes of MIL-R-9300 B.

HexPly® M76 is a versatile curing toughened epoxy resin that can be cured from 275ºF (135ºC) to 350ºF (177ºC), depending on service temperature requirements. HexPly® M76 is formulated for lower temperature autoclave or press mold processing. The recommended lay-up procedure for HexPly® M76 is HSP-L4. The recommended cure procedures are HSP-C5 (275ºF) or HSP-C1 (350ºF).

HexPly® M65 is a bismaleimide resin that cures via an addition reaction in a toughened two-phase thermoset matrix with no condensation by-products. HexPly® M65 is a controlled bimaleimide resin system designed for alternative processing capabilities such as co-curing over honeycomb core, compression molding, as well as standard autoclave processing. HexPly® M65 has improved tack levels and performs well for fiber placement applications.

HexPly® 954-2A is a 350ºF (177ºC) curing toughened cyanate resin with low moisture absorption, and excellent microcracking resistance. HexPly® 954-2A is formulated for autoclave or press molding. Recommended cure is two hours at 350ºF (177ºC). The recommended lay-up procedure is HSP-L3. The recommended cure procedure is HSP-C1 or HSP-C3. Typical applications for HexPly® 954-2A include primary and secondary aircraft structure, space structures, cryogenic tanks, or any application where impact resistance, light weight and excellent dielectric properties are required. HexPly® 945-2A can be impregnated via hot melt or solution techniques on all available fibers and fabrics.

HexPly® F655™ is a bismaleimide resin that cures via an addition reaction in a toughened two-phase thermoset matrix with no condensation by-products. HexPly® F655™ is a controlled flow polyimide resin system designed for alternative processing capabilities such as co-curing over honeycomb core, compression molding, as well as standard autoclave processing.

HexPly® 954-3 is a 350ºF (177ºC) curing cyanate resin with excellent resistance to moisture absorption, outgassing and microcracking. HexPly® 954-3 is formulated for autoclave or press molding using a standard cure of two hours at 350ºF (177ºC). Glass transition temperature can be maximized by post curing at 450ºF (232ºC). The recommended lay-up procedure is HSP-L3. The recommended cure procedure is HSP-C1 or HSP-C2.

HexPly® F652 is a bismaleimide resin that cures via an addition reaction with no condensation by-products. HexPly® F652 is a controlled flow polyimide resin system designed for alternative processing capabilities such as co-curing over honeycomb core, compression molding, as well as standard autoclave processing.

HexPly® M20 is an epoxy structural prepreg, designed to provide high temperature performance combined with a low energy cure cycle. Due to its processing flexibility (vacuum bag or autoclave) it is ideally suitable for composite repair. HexPly® M20 cures at 130°C (265°F) to form a tough, high temperature resistant fibrereinforced composite. HexPly® M20 has been chosen as a standardized repair material by the Commercial Aircraft Composite Repair Committee (CACRC) which sets global aerospace standards for composite repair. HexPly® M20 is available as woven carbon and UD carbon tape for structural repairs. The pre-impregnated woven glass version is used for non-structural galvanic corrosion protection.

HexPly® 954-6 is a 250ºF (121ºC) curing toughened cyanate resin with 300ºF (149ºC) Tg. HexPly® 954-6 is formulated for autoclave curing. Recommended cure is three hours at 250 F (121ºC). Service temperatures are maximized by a post cure of 350ºF - 450ºF (177ºC - 205ºC). The recommended lay-up procedure is HSP-L3. The recommended cure procedure is HSP-C4. Typical applications for HexPly® 954-6 include space structures, such as solar arrays, antennae and support structures, or any application where impact resistance, light weight, excellent dielectric and low outgassing properties are required. HexPly® 954-6 can be impregnated on all available fibers and fabrics.

HexPly® F185™ is an advanced epoxy formulation designed for autoclave curing to offer very high sandwich and metal bonding strengths with moderate laminate strengths. HexPly® F185™ is a structural adhesive and cocuring grade epoxy resin with a 250°F (121°C) cure. This system offers the highest available fracture toughness and strain to failure of the 250°F (121°C) cure resins.

HexPly® 996 is a 350ºF (177ºC) curing cyanate siloxane resin with a 330ºF (165ºC) glass transition temperature. Standard cure is two hours at 350ºF (177ºC). HexPly® 996 can be autoclave and press cured. HexPly® 996 can be impregnated on all available fibers and fabrics. The recommended lay-up procedure for HexPly® 996 is HSP-L3. The recommended cure procedure is HSP-C1 or HSP-C6. Typical applications for HexPly® 996 are primary and secondary space structures where the optimum dimensional stability and lowest moisture absorption are required.

HexPly® M56 is a high performance epoxy matrix developed for out-of-autoclave curing of composite aircraft structures.

HexPly® F515 is an advanced, industrial grade, modified epoxy formulation designed for either vacuum bag or autoclave curing to offer very high laminate strengths, coupled with increased fracture toughness. HexPly® F515 has a 250°F (121°C) cure.

HexPly® 954-3A is a 350ºF (177ºC) curing cyanate resin with a 400ºF (204ºC) glass transition temperature. Standard cure is two hours at 350ºF (177ºC). Glass transition temperatures can be maximized by a free-standing post cure at 450ºF (232ºC). HexPly® 954-3A is a controlled flow cyanate resin designed for autoclave and vacuum bag curing. HexPly® 954-3A can be impregnated on all available fibers and fabrics. The recommended lay-up procedure for HexPly® 954-3A is HSP-L3. The recommended cure procedure is HSP-C1. Typical applications for HexPly® 954-3A are primary and secondary space structures where dimensional stability and low moisture absorption are required.

HexPly® M73 is a 350°F (177°C) curing toughened resin with 350°F (177°C) dry and 270°F (132°C) wet service capabilities. HexPly® M73 is formulated for autoclave or press molding and can be cured at 350°F for six hours. A two-hour cure at 350°F with two-hour post-cure at 390°F may also be used. Unidirectional tape and woven fabric impregnated with HexPly® M73 resin will retain tack for 10 or more days at room temperature.

M74 is a high flow, 350°F (177°C) curing epoxy resin with extensive space structural heritage*. M74 is formulated for autoclave processing, but it has been successfully processed by press molding. Unidirectional tape and woven fabric impregnated with M74 resin will retain good tack and drape for at least 10 days at 70°F (21°C). Standard cure is for two hours at 350°F (177°C). Hexcel recommended lay-up procedure is HSP-L1 or HSP-L2. Recommended cure procedure is HSP-C1 or HSP-C2.