Products

SKYBOND® 703 is a heat reactive aromatic resin which can be thermally cured to a crosslinked polyimide. It is specifically designed for structual, and specialty applications where extended high temperature exposure is required. It represents an excellent balance of processing advantages and high thermal stability .Excellent strength retention is maintained up to temperatures of 650° F.

SKYBOND® 700 is a heat reactive aromatic resin which can be thermally cured to a crosslinked polyimide. It is specifically designed for structural and specially applications where extended exposure at temperatures up to 700° F is required.

SKYBOND® 705 is a heat reactive aromatic resin which can be thermally cured to a crosslinked polyimide with high heat resistance. It has good film forming properties and it is designed for coating applications where extended high temperature exposure is required.

SKYBOND® 7621 is a solution of aromatic polyimide precursor in ethanol, xylene, and n-methyl pyrrolidone (NMP)

SKYBOND® 701 is a solution of aromatic polyimide precursor in ethanol and methanol.

SKYBOND® 875 is a polymide precursor which is 2 stage cured.

SKYBOND® 800 is a polymide precursor which is 2 stage cured.