Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Substrate
- EMC
- Material Type
- Ink (low viscosity)
- Main Components
- Ag nanopowder Silver ion complex
- Process method
- Dispensing nozzle
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
Applications & Uses
- Applications
- Application Area
- Application Method
- Compatible Substrates & Surfaces
- Applicables
Semiconductor and EMI Shielding
Properties
- Typical Properties
Value | Units | Test Method / Conditions | |
Curing Temperature (30min) | 150.0 | °C | — |
Volume Resistivity | 8.0 X 10^-6 | Ωcm | — |
Viscosity (at 20rpm) | 50 - 60 | cps | — |
Adhesion | 5 - 4B | — | — |