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Inktec TEC-PA-070

Inktec TEC-PA-070 is a cost effectiveness, less consumption, stability over 70μm and has an excellent adhesion. It has a high density after curing because it has few or no gab between particles. That is why our ink can materialize fine pattern with high conductivity.

Application Area: Printed Electronics, RFID, Touch Panels (Smartglass)

Compatible Substrates & Surfaces: Glass, Paper, Plastics

Features: Conductive, Cost Effective, Excellent Substrate Adhesion, Good Stability, High Viscosity

Application Method: Screen Coating

Chemical Family: Silver & Silver Compounds

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Patterning Method
Screen
Material Type
Conductive paste (High viscosity)
Main Components
Ag powder
Substrate
ITO, PET, Glass, Paper, ETC

Features & Benefits

Remark
Hybrid Ink
Features
  • Optimization in Fine Pattern & Thin Layer
  • Short Curing Time in a Low-temperature

Applications & Uses

Application Method
Compatible Substrates & Surfaces
Applications

Touch Panel, Solar Cell, Display, EMI Shielding, RFID and so on.

Applicables

TSP Bezel, Health care, Sensor, Display, Smart Label, Wearable, Membrane, etc.

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Curing Temperature (Convection oven 20min)130.0°C
Layer Thickness (After curing)2021-06-08μm
Volume Resistance (on ITO)max. 3.0×10^-4Ωcm
Available Line Widthmin. 80μm
Viscosity (at 20rpm)125000.0cps
Adhesion5 - 4B