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Inktec TEC-PL-010

Inktec TEC-PL-010 prevent film shrinkage of substrate by heating and low Temperature curing. It has a high density after curing because it has few or no gab between particles. That is why our ink can materialize fine pattern with high conductivity.

Application Area: Printed Electronics, RFID, Touch Panels (Smartglass)

Compatible Substrates & Surfaces: Glass, Paper, Plastics

Features: Conductive, Excellent Substrate Adhesion, High Viscosity, Low Temperature Curing

Application Method: Screen Coating

Chemical Family: Silver & Silver Compounds

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Patterning Method
Screen
Substrate
ITO, PET, Glass, Paper, ETC
Material Type
Conductive paste (High viscosity)
Main Components
Ag powder

Features & Benefits

Features
  • Optimization in Fine Pattern & Thin Layer
  • Short Curing Time in a Low-temperature

Applications & Uses

Application Method
Compatible Substrates & Surfaces
Applications

Touch Panel, Solar Cell, Display, EMI Shielding, RFID and so on.

Applicables

TSP Bezel, Health care, Sensor, Display, Smart Label, Wearable, Membrane, etc.

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Curing Temperature (Convection oven,20min)100.0°C
Layer Thickness (After curing)2021-06-08μm
Volume Resistance (on ITO)max. 6.5×10^-5Ωcm
Available Line Widthmin. 80μm
Viscosity (at 20rpm)130000.0cps
Adhesion5 - 4B