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ASTRA® MT77 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range. Astra MT77 is suitable for many of today’s commercial RF/microwave printed circuit designs. It features a dielectric constant (Dk) that is stable between -40°C and +140°C at up to W-band frequencies. In addition, Astra MT77 offers an ultra-low dissipation factor (Df) of 0.0017, making it a cost-effective alternative to PTFE and other commercial microwave laminate materials. Key applications include long antennas and radar applications for automobiles, such as adaptive cruise control, pre-crash, blind spot detection, lane departure warning and stop and go systems.

Functions: Laminate

End Uses: PCB Materials

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Composite Materials Functions

Features & Benefits

Ready-to-Use Product Features
Product Features

Industry Recognition

  • UL File Number: E41625
  • RoHS Compliant

Performance Attributes

  • Lead-free assembly compatible

Processing Advantages

  • FR-4 process compatible
  • Short lamination cycle
  • Reduced drill wear
  • No plasma desmear required
  • Good flow and fill
  • Dimensional stability
  • Multiple lamination cycles
  • Any layer technology compatible
  • HDI technology compatible
  • VIPPO design compatible

Product Attributes

  • High Density Interconnect
  • Radio Frequency and Microwave
  • High Thermal Reliability

Applications & Uses

Composites End Use
Typical Market Applications
  • High Density Interconnect
  • Radio Frequency and Microwave
  • Aerospace and Defense

Properties

Flame Rating
Typical Properties
ValueUnitsTest Method / Conditions
Arc Resistance139.0SecondsIPC-TM-650
Comparative Tracking Index (CTI)3 (175-249)VoltsASTM D3638
Decomposition Temperature (Td) by TGA (5% weight loss)360.0°CIPC-TM-650
Dielectric Breakdown45.4kVIPC-TM-650
Dk, Loss Tangent(10 GHz)0.0017IPC-TM-650
Dk, Loss Tangent(2 GHz)0.0017IPC-TM-650
Dk, Permittivity(10 GHz)3.0IPC-TM-650
Dk, Permittivity(2 GHz)3.0IPC-TM-650
Electric Strength (Laminate & laminated prepreg)45 (1133)kV/mm (V/mil)IPC-TM-650
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Flexural Strength Cross direction39.0ksiIPC-TM-650
Flexural Strength Length direction49.0ksiIPC-TM-650
Glass Transition Temperature (Tg) by DSC200.0°CIPC-TM-650
Moisture Absorption0.1%IPC-TM-650
Peel Strength (1 oz. EDC foil)1.0 (5.7)N/mm (lb/inch)IPC-TM-650
Poisson's Ratio Cross direction0.182ASTM D3039
Poisson's Ratio Length direction0.183ASTM D3039
Relative Thermal Index (RTI)130.0°CUL 796
Surface Resistivity (C-96/35/90)1.33 x 10^5IPC-TM-650
Tensile Strength Cross direction24.0ksiASTM D3039
Tensile Strength Length direction31.0ksiASTM D3039
Thermal Conductivity0.45W/m·KASTM E1952
Thermal Stress Etched [10 sec, 288ºC (550.4ºF)]PassIPC-TM-650
Thermal Stress Unetched [10 sec, 288ºC (550.4ºF)]PassIPC-TM-650
Time to Delaminate by T260 (Copper removed)min. 60MinutesIPC-TM-650
Time to Delaminate by T288 (Copper removed)min. 60MinutesIPC-TM-650
Volume Resistivity (C-96/35/90)1.33 x 10^7MΩ-cmIPC-TM-650
X/Y-Axis CTE Pre-Tg12.0ppm/°CIPC-TM-650
Z-Axis CTE Post-Tg250 - 350ppm/°CIPC-TM-650
Z-Axis CTE Pre-Tg50 - 70ppm/°CIPC-TM-650

Regulatory & Compliance

Certifications & Compliance

Packaging & Availability

Product Availability

Standard Material Offering: Laminate

  • 2.5, 5, 7.5, 10, 12.5, 15, 20, 30, 60 mil (0.0635, 0.127, 0.1905, 0.254, 0.3175, 0.381, 0.510, 0.760, 1.50 mm)

Copper Foil Type

  • HVLP (VLP2) ≤2.5 micron Rz JIS, 1 oz and below is standard

Copper Weight

  • ½ to 2 oz (18 to 70 μm) available
  • Thinner copper foil available

Standard Material Offering: Prepreg

  • Roll or panel form
  • Tooling of prepreg panels