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I-TERA® MT40 is suitable for many of today’s high speed digital and RF/microwave printed circuit designs. I-Tera MT40 features a dielectric constant (Dk) that is stable between - 55°C and +125°C up to W-band frequencies. In addition, I-Tera MT40 offers a lower dissipation factor (Df) of 0.0031 making it a cost effective alternative to PTFE and other commercial microwave and high-speed digital laminate materials. I-Tera MT40 laminate materials are currently being offered in both laminate and prepreg form in typical thicknesses and standard panel sizes. This provides a complete materials solution package for high-speed digital multilayer, hybrid, RF/microwave, multilayer and double-sided printed circuit designs. I-Tera MT40 does not require any special through hole treatments commonly needed when processing PTFE-based laminate materials.

Functions: Laminate, Prepreg

End Uses: Medical Devices, PCB Materials

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Composite Materials Functions

Features & Benefits

Ready-to-Use Product Features
Product Features

Industry Recognition

  • UL File Number: E41625
  • RoHS Compliant

Performance Attributes

  • CAF resistant
  • Lead-free assembly compatible

Processing Advantages

  • FR-4 process compatible
  • Multiple reflow capable
  • Multiple lamination cycles

Product Attributes

  • High Density Interconnect
  • High Speed Digital
  • High Thermal Reliability

Applications & Uses

Typical Market Applications
  • Automative and Transportation
  • Networking and Communications
  • Aerospace and Defense
  • Compuiting Storage and Peripherels
  • Medical, Industrial and Instrumentation

Properties

Flame Rating
Typical Properties
ValueUnitsTest Method / Conditions
Arc Resistance139.0SecondsIPC-TM-650
Comparative Tracking Index (CTI)3.0VoltsASTM D3638
Decomposition Temperature by TGA (5% weight loss)360.0°CIPC-TM-650
Dielectric Breakdown45.4kVIPC-TM-650
Dk, Loss Tangent(10 GHz)0.0031IPC-TM-650
Dk, Loss Tangent(2 GHz)0.0031IPC-TM-650
Dk, Loss Tangent(5 GHz)0.0031IPC-TM-650
Dk, Permittivity(10 GHz)3.45IPC-TM-650
Dk, Permittivity(2 GHz)3.45IPC-TM-650
Dk, Permittivity(5 GHz)3.45IPC-TM-650
Electric Strength (Laminate & laminated prepreg)45 (1133)kV/mm (V/mil)IPC-TM-650
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Flexural Strength Cross direction58.0ksiIPC-TM-650
Flexural Strength Length direction71.0ksiIPC-TM-650
Glass Transition Temperature (Tg) by DSC200.0°CIPC-TM-650
Glass Transition Temperature (Tg) by TMA205.0°CIPC-TM-650
Moisture Absorption0.1%IPC-TM-650
Peel Strength (1 oz. EDC foil)1.0 (5.7)N/mm (lb/inch)IPC-TM-650
Poisson's Ratio Cross direction0.222ASTM D3039
Poisson's Ratio Length direction0.234ASTM D3039
Relative Thermal Index (RTI)130.0°CUL 796
Surface Resistivity (C-96/35/90)1.33 x 10^5IPC-TM-650
Tensile Strength Cross direction35.0ksiASTM D3039
Tensile Strength Length direction39.0ksiASTM D3039
Thermal Conductivity0.61W/m·KASTM E1952
Thermal Stress Etched [10 sec, 288ºC (550.4ºF)]PassIPC-TM-650
Thermal Stress Unetched [10 sec, 288ºC (550.4ºF)]PassIPC-TM-650
Time to Delaminate by T260 (Copper removed)min. 60MinutesIPC-TM-650
Time to Delaminate by T288 (Copper removed)min. 60MinutesIPC-TM-650
Volume Resistivity (C-96/35/90)1.33 x 10^7MΩ-cmIPC-TM-650
X/Y-Axis CTE Pre-Tg12.0ppm/°CIPC-TM-650
Young's Modulus Cross direction2784.0ksiASTM D790-15e2
Young's Modulus Length direction3060.0ksiASTM D790-15e2
Z-Axis CTE 50 to 260°C, (Total Expansion)2.8%IPC-TM-650
Z-Axis CTE Post-Tg290.0ppm/°CIPC-TM-650
Z-Axis CTE Pre-Tg55.0ppm/°CIPC-TM-650

Regulatory & Compliance

Certifications & Compliance

Packaging & Availability

Product Availability

Standard Material Offering: Laminate

  • 2 to 18 mil (0.05 to 0.46 mm)
  • 10, 20, 30, 60 mil (0.25, 0.51, 0.76, 1.5 mm)
  • Available in full size sheet or panel form

Copper Foil Type

  • HTE Grade 3
  • HVLP (VLP2) ≤2.5 micron Rz JIS, 1 oz and below is standard
  • RTF (Reverse Treat Foil)

Copper Weight

  • ½ to 2 oz (18 to 70 µm) available
  • Heavier copper available
  • Thinner copper foil available

Standard Material Offering: Prepreg

  • Roll or panel form
  • Tooling of prepreg panels

Glass Fabric Availability

  • E-glass
  • Square weave glass
  • Mechanically spread glass