Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Reinforcement Material
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Ready-to-Use Product Features
- Product Features
Industry Recognition
- UL File Number: E41625
- Polyclad®Grade PCL-FR-370HR
- Qualified to UL’s MCIL Program
- RoHS Compliant
Performance Attributes
- CAF resistant
Processing Advantages
- FR-4 process compatible
- UV blocking and AOI fluorescence
- Multiple reflow capable
- HDI technology compatible
Product Attributes
- High Density Interconnect
- High Thermal Reliability
Applications & Uses
- Applications
- Composites End Use
- Typical Market Applications
- Networking and Communications
- Aerospace and Defense
- Computing, Storage and Peripherels
- Medical, Industrial and Instrumentation
- Consumer Electronics
- Automative and Transportation
Properties
- Flame Rating
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Arc Resistance | 115.0 | Seconds | IPC-TM-650 |
| Comparative Tracking Index (CTI) | 3 (175-249) | Volts | UL 746A ASTM D3638 |
| Decomposition Temperature (Td) by TGA (5% weight loss) | 340.0 | °C | IPC-TM-650 |
| Dielectric Breakdown | min. 50 | kV | IPC-TM-650 |
| Dk, Loss Tangent(1 GHz) | 0.0161 | — | IPC-TM-650 |
| Dk, Loss Tangent(10 GHz) | 0.025 | — | IPC-TM-650 |
| Dk, Loss Tangent(100 MHz) | 0.015 | — | IPC-TM-650 |
| Dk, Loss Tangent(2 GHz) | 0.021 | — | IPC-TM-650 |
| Dk, Loss Tangent(5 GHz) | 0.025 | — | IPC-TM-650 |
| Dk, Permittivity(1 GHz) | 4.17 | — | IPC-TM-650 |
| Dk, Permittivity(10 GHz) | 3.92 | — | IPC-TM-650 |
| Dk, Permittivity(100 MHz) | 4.24 | — | IPC-TM-650 |
| Dk, Permittivity(2 GHz) | 4.04 | — | IPC-TM-650 |
| Dk, Permittivity(5 GHz) | 3.92 | — | IPC-TM-650 |
| Electric Strength (Laminate & laminated prepreg) | 54 (1350) | kV/mm (V/mil) | IPC-TM-650 |
| Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 |
| Flexural Strength Cross direction | 77.0 | ksi | IPC-TM-650 |
| Flexural Strength Length direction | 90.0 | ksi | IPC-TM-650 |
| Glass Transition Temperature (Tg) by DSC | 180.0 | °C | IPC-TM-650 |
| Moisture Absorption | 0.15 | % | IPC-TM-650 |
| Peel Strength (Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]) | 1.14 (6.5) | N/mm (lb/inch) | IPC-TM-650 |
| Peel Strength [125ºC (257ºF) (Standard profile copper)] | 1.25 (7.0) | N/mm (lb/inch) | IPC-TM-650 |
| Peel Strength After process solutions (Standard profile copper) | 1.14 (6.5) | N/mm (lb/inch) | IPC-TM-650 |
| Peel Strength After thermal stress (Standard profile copper) | 1.25 (7.0) | N/mm (lb/inch) | IPC-TM-650 |
| Poisson's Ratio Cross direction | 0.171 | — | ASTM D3039 |
| Poisson's Ratio Length direction | 0.177 | — | ASTM D3039 |
| Relative Thermal Index (RTI) | 130.0 | °C | UL 796 |
| Surface Resistivity (After moisture resistance) | 3.0 x 10^6 | MΩ | IPC-TM-650 |
| Surface Resistivity (At elevated temperature) | 2.0 x 10^8 | MΩ | IPC-TM-650 |
| Tensile Strength Cross direction | 35.6 | ksi | ASTM D3039 |
| Tensile Strength Length direction | 55.9 | ksi | ASTM D3039 |
| Thermal Conductivity | 0.4 | W/m·K | ASTM E1952 |
| Thermal Stress Etched [10 sec, 288ºC (550.4ºF)] | Pass | — | IPC-TM-650 |
| Thermal Stress Unetched [10 sec, 288ºC (550.4ºF)] | Pass | — | IPC-TM-650 |
| Time to Delaminate by T260 (Copper removed) | 60.0 | Minutes | IPC-TM-650 |
| Time to Delaminate by T288 (Copper removed) | 30.0 | Minutes | IPC-TM-650 |
| Volume Resistivity (After moisture resistance) | 3.0 x 10^8 | MΩ-cm | IPC-TM-650 |
| Volume Resistivity (At elevated temperature) | 7.0 x 10^8 | MΩ-cm | IPC-TM-650 |
| X/Y-Axis CTE Pre-Tg | 13/14 | ppm/°C | IPC-TM-650 |
| Young's Modulus Cross direction | 3178.0 | ksi | ASTM D790-15e2 |
| Young's Modulus Length direction | 3744.0 | ksi | ASTM D790-15e2 |
| Z-Axis CTE 50 to 260°C, (Total Expansion) | 2.8 | % | IPC-TM-650 |
| Z-Axis CTE Post-Tg | 230.0 | ppm/°C | IPC-TM-650 |
| Z-Axis CTE Pre-Tg | 45.0 | ppm/°C | IPC-TM-650 |
Regulatory & Compliance
- Certifications & Compliance
Packaging & Availability
- Product Availability
Standard Material Offering: Laminate
- 2 to 125 mil (0.05 to 3.2 mm)
- Available in full size sheet or panel form
Copper Foil Type
- HTE Grade 3
- RTF (Reverse Treat Foil)
Copper Weight
- ½ to 2 oz (18 to 70 µm) available
- Heavier copper available
- Thinner copper foil available
Standard Material Offering: Prepreg
- Roll or panel form
- Tooling of prepreg panels
Glass Fabric Availability
- E-glass
- Square weave glass
- Mechanically spread glass