Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Reinforcement Material
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Product Features
Industry Recognition
- UL File Number: E41625
- RoHS Compliant
Processing Advantages
- FR-4 process compatible
- UV blocking and AOI fluorescence
Product Attributes
- Legacy
Properties
- Flame Rating
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Arc Resistance | 120.0 | Seconds | IPC-TM-650 |
| Comparative Tracking Index (CTI) | 3 (175-249) | Volts | ASTM D3638 |
| Decomposition Temperature (Td) by TGA (5% weight loss) | 315.0 | °C | IPC-TM-650 |
| Dielectric Breakdown | min. 50 | kV | IPC-TM-650 |
| Dk, Loss Tangent(100 MHz) | 0.016 | — | IPC-TM-650 |
| Dk, Loss Tangent(500 MHz) | 0.015 | — | IPC-TM-650 |
| Dk, Permittivity(1 GHz) | 4.25 | — | IPC-TM-650 |
| Dk, Permittivity(100 MHz) | 4.6 | — | IPC-TM-650 |
| Dk, Permittivity(500 MHz) | 4.27 | — | IPC-TM-650 |
| Electric Strength (Laminate & laminated prepreg) | 29 (1100) | kV/mm (V/mil) | IPC-TM-650 |
| Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 |
| Flexural Strength Cross direction | 62.3 | ksi | IPC-TM-650 |
| Flexural Strength Length direction | 92.0 | ksi | IPC-TM-650 |
| Glass Transition Temperature (Tg) by DSC | 140.0 | °C | IPC-TM-650 |
| Moisture Absorption | 0.3 | % | IPC-TM-650 |
| Peel Strength (Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]) | 1.05 (8.0) | N/mm (lb/inch) | IPC-TM-650 |
| Peel Strength [125ºC (257ºF) (Standard profile copper)] | 1.25 (8.0) | N/mm (lb/inch) | IPC-TM-650 |
| Peel Strength After process solutions (Standard profile copper) | 1.45 (9.0) | N/mm (lb/inch) | IPC-TM-650 |
| Peel Strength After thermal stress (Standard profile copper) | 1.45 (9.0) | N/mm (lb/inch) | IPC-TM-650 |
| Relative Thermal Index (RTI) | 130.0 | °C | UL 796 |
| Surface Resistivity (At elevated temperature) | 6 x 10^6 | MΩ | IPC-TM-650 |
| Surface Resistivity (C-96/35/90) | 3.0 x 10^6 | MΩ | IPC-TM-650 |
| Tensile Strength Cross direction | 43.2 | ksi | ASTM D3039 |
| Tensile Strength Length direction | 60.0 | ksi | ASTM D3039 |
| Thermal Conductivity | 0.36 | W/m·K | ASTM E1952 |
| Thermal Stress Etched [10 sec, 288ºC (550.4ºF)] | Pass | — | IPC-TM-650 |
| Thermal Stress Unetched [10 sec, 288ºC (550.4ºF)] | Pass | — | IPC-TM-650 |
| Time to Delaminate by T260 (Copper removed) | 30.0 | Minutes | IPC-TM-650 |
| Time to Delaminate by T288 (Copper removed) | min. 5 | Minutes | IPC-TM-650 |
| Volume Resistivity (At elevated temperature) | 7.0 x 10^7 | MΩ-cm | IPC-TM-650 |
| Volume Resistivity (C-96/35/90) | 4.0 x 10^8 | MΩ-cm | IPC-TM-650 |
| X/Y-Axis CTE Pre-Tg | 15.0 | ppm/°C | IPC-TM-650 |
| Young's Modulus Cross direction | 3000.0 | ksi | ASTM D790-15e2 |
| Young's Modulus Length direction | 3500.0 | ksi | ASTM D790-15e2 |
| Z-Axis CTE 50 to 260°C, (Total Expansion) | 4.2 | % | IPC-TM-650 |
| Z-Axis CTE Post-Tg | 250.0 | ppm/°C | IPC-TM-650 |
| Z-Axis CTE Pre-Tg | 50.0 | ppm/°C | IPC-TM-650 |
Regulatory & Compliance
- Certifications & Compliance
Packaging & Availability
- Product Availability
Standard Material Offering: Laminate
- 2 to 125 mil (0.05 to 3.2 mm)
- Available in full size sheet or panel form
Copper Foil Type
- HTE Grade 3
- RTF (Reverse Treat Foil)
Copper Weight
- ½ to 2 oz (18 to 70 µm) available
- Heavier copper available
- Thinner copper foil available
Standard Material Offering: Prepreg
- Roll or panel form
- Tooling of prepreg panels
Glass Fabric Availability
- E-glass
- Square weave glass