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Isola FR406

Isola FR406 is engineered to meet the demands of the multilayer printed circuit board industry, while maintaining standard FR-4 processing. FR406 offers improved dimensional control, superior chemical and thermal performance and product consistency.

Functions: Laminate

Reinforcement Material: Glass Fibers

End Uses: PCB Materials

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Reinforcement Material
Composite Materials Functions

Features & Benefits

Ready-to-Use Product Features
Product Features

Industry Recognition

  • UL File Number: E41625
  • RoHS Compliant

Processing Advantages

  • FR-4 process compatible
  • UV blocking and AOI fluorescence
  • No post bake after pressing

Product Attributes

  • Legacy

Applications & Uses

Composites End Use

Properties

Flame Rating
Typical Properties
ValueUnitsTest Method / Conditions
Arc Resistance90.0SecondsIPC-TM-650
Comparative Tracking Index (CTI)3 (175-249)VoltsUL 746A ASTM D3638
Decomposition Temperature (Td) by TGA (5% weight loss)300.0°CIPC-TM-650
Dielectric Breakdownmin. 50kVIPC-TM-650
Dk, Loss Tangent(1 GHz)0.0161IPC-TM-650
Dk, Loss Tangent(10 GHz)0.0172IPC-TM-650
Dk, Loss Tangent(100 MHz)0.013IPC-TM-650
Dk, Loss Tangent(2 GHz)0.0167IPC-TM-650
Dk, Loss Tangent(5 GHz)0.0172IPC-TM-650
Dk, Permittivity(1 GHz)3.95IPC-TM-650
Dk, Permittivity(10 GHz)3.92IPC-TM-650
Dk, Permittivity(100 MHz)4.0IPC-TM-650
Dk, Permittivity(2 GHz)3.93IPC-TM-650
Dk, Permittivity(5 GHz)3.92IPC-TM-650
Electric Strength (Laminate & laminated prepreg)44 (1100)kV/mm (V/mil)IPC-TM-650
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Flexural Strength Cross direction78.2ksiIPC-TM-650
Flexural Strength Length direction93.7ksiIPC-TM-650
Glass Transition Temperature (Tg) by DSC170.0°CIPC-TM-650
Moisture Absorption0.2%IPC-TM-650
Peel Strength (Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil])1.19 (7.0)N/mm (lb/inch)IPC-TM-650
Peel Strength [125ºC (257ºF) (Standard profile copper)]1.19 (7.0)N/mm (lb/inch)IPC-TM-650
Peel Strength After process solutions (Standard profile copper)1.60 (9.0)N/mm (lb/inch)IPC-TM-650
Peel Strength After thermal stress (Standard profile copper)1.60 (9.0)N/mm (lb/inch)IPC-TM-650
Poisson's Ratio Cross direction0.154ASTM D3039
Poisson's Ratio Length direction0.191ASTM D3039
Relative Thermal Index (RTI)130.0°CUL 796
Surface Resistivity (At elevated temperature)8 x 10^8IPC-TM-650
Surface Resistivity (C-96/35/90)3.0 x 10^8IPC-TM-650
Tensile Strength Cross direction47.7ksiASTM D3039
Tensile Strength Length direction63.0ksiASTM D3039
Thermal Conductivity0.3-0.4W/m·KASTM E1952
Thermal Stress Etched [10 sec, 288ºC (550.4ºF)]PassIPC-TM-650
Thermal Stress Unetched [10 sec, 288ºC (550.4ºF)]PassIPC-TM-650
Time to Delaminate by T260 (Copper removed)10.0MinutesIPC-TM-650
Time to Delaminate by T288 (Copper removed)min. 2MinutesIPC-TM-650
Volume Resistivity (At elevated temperature)3.0 x 10^7MΩ-cmIPC-TM-650
Volume Resistivity (C-96/35/90)9.0 x 10^7MΩ-cmIPC-TM-650
X/Y-Axis CTE Pre-Tg13.0ppm/°CIPC-TM-650
Young's Modulus Cross direction3116.0ksiASTM D790-15e2
Young's Modulus Length direction3684.0ksiASTM D790-15e2
Z-Axis CTE 50 to 260°C, (Total Expansion)3.5%IPC-TM-650
Z-Axis CTE Post-Tg250.0ppm/°CIPC-TM-650
Z-Axis CTE Pre-Tg60.0ppm/°CIPC-TM-650

Regulatory & Compliance

Certifications & Compliance

Packaging & Availability

Product Availability

Standard Material Offering: Laminate

  • 2 to 125 mil (0.05 to 3.2 mm)
  • Available in full size sheet or panel form

Copper Foil Type

  • HTE Grade 3
  • RTF (Reverse Treat Foil)

Copper Weight

  • ½ to 2 oz (18 to 70 µm) available
  • Heavier copper available
  • Thinner copper foil available

Standard Material Offering: Prepreg

  • Roll or panel form
  • Tooling of prepreg panels

Glass Fabric Availability

  • E-glass
  • Square weave glass